POS 多协议模块

结果: 110
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
Silex Technology 多协议模块 1x1 Wi-Fi+BLE radio /baseband SDIO Card 无库存交货期 30 周
最低: 100
倍数: 100

SX-SDCAC Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology 多协议模块 Wi-Fi+BLE Mod 2 ufl connectors 无库存交货期 30 周
最低: 500
倍数: 500
: 500

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology 多协议模块 Wi-Fi+BLE Mod SM w/Ant uFl connector 无库存交货期 30 周
最低: 500
倍数: 500
: 500

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Patch, 1559-1606, GNSS L1, Ceramic, -, -, Pin Mounting, 10 10 4 无库存交货期 5 周
最低: 1
倍数: 1

1.559 GHz to 1.606 GHz ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 - 35 C + 75 C Patch 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS
Quectel 多协议模块 External, 824-2700, LTE (4G), Dipole, -, SMA Male (center pin) , Terminal, 190 16 无库存交货期 5 周
最低: 1
倍数: 1

824 MHz to 2.7 GHz ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C SMA 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS
Silex Technology 多协议模块 802.11a/b/g/n/ac SDIO SiP 2.4/5 GHz 无库存交货期 34 周
最低: 3,000
倍数: 3,000
: 3,000

SX-SDPAC 2.4 GHz, 5 GHz SDIO, UART 3.3 V 3.3 V - 20 C + 70 C 6.9 mm x 6.9 mm x 1.082 mm Bluetooth 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA 2S), 2MB Flash, -40 85C 无库存交货期 8 周
最低: 500
倍数: 500
: 500

2.4 GHz ADC, GPIO, PWM, UART 3 V 3.6 V - 40 C + 85 C 17.91 mm x 14.99 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA 2S), 4MB Flash, -40 85C 无库存交货期 8 周
最低: 500
倍数: 500
: 500

2.4 GHz ADC, GPIO, PWM, UART 3 V 3.6 V - 40 C + 85 C 17.91 mm x 14.99 mm x 2.8 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA LC9), 4MB Flash, Ceramic antenna, -40 105C 无库存交货期 8 周
最低: 500
倍数: 500
: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 16.8 mm x 15 mm x 1.85 mm Bluetooth 5.2 802.11 b/g/n Reel
Quectel 多协议模块 Wi-Fi 4, 2.4GHz, BLE5.2, QuecOpen for Matter (pin compatible w/ TUYA LC9), 2MB Flash, Ceramic antenna, -40 105C 无库存交货期 8 周
最低: 500
倍数: 500
: 500

2.4 GHz ADC, GPIO, PWM 3 V 3.6 V - 40 C + 105 C 16.8 mm x 15 mm x 1.85 mm Bluetooth 5.2 802.11 b/g/n Reel
Silex Technology 多协议模块 802.11a/b/g/n/ac WLAN + BLE 4.2 SDIO 无库存交货期 30 周
最低: 500
倍数: 500
: 500
2.402 GHz to 2.48 GHz, 5.18 GHz to 5.825 GHz UART 3.3 V 3.3 V - 20 C + 85 C u.FL 17 mm x 18 mm x 2.6 mm BLE, Bluetooth 802.11 a/b/g/n/ac Reel
Silex Technology 多协议模块 802.11a/b/g/n/ac WLAN + BLE 4.2 SDIO 无库存交货期 30 周
最低: 500
倍数: 500
: 500

2.402 GHz to 2.48 GHz, 5.18 GHz to 5.825 GHz UART 3.3 V 3.3 V - 20 C + 85 C u.FL 17 mm x 18 mm x 2.6 mm BLE, Bluetooth 802.11 a/b/g/n/ac Reel


Quectel 多协议模块 External, 2400-2500 MHz, 5150-5850 MHz, Wi-Fi 6 (Bluetooth), Dipole, -, SMA Male (center pin), Terminal, 200 13 交货期 5 周
最低: 1
倍数: 1

2.4 GHz to 2.5 GHz, 5.15 GHz to 5.85 GHz 33 dBm ADC, I2C, PCM, SDIO, SGMII, UART, USB 2.0 3.3 V 4.3 V - 40 C + 85 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 1 GNSS
Quectel EC200UEUAA-N05-TA0AA
Quectel 多协议模块 External, 1561, 1575, GNSS L1&B1&G1 (passive), Ceramic, 3000 +/-20, SMA Male (center pin), Magnetic, 50.3 38.4 17.1 无库存交货期 5 周
最低: 1
倍数: 1
2.4 GHz ADC, Audio, I2C, SPI, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C External 31 mm x 28 mm x 2.4 mm Bluetooth 4.2 BR/EDR LTE Cat 1 BeiDou, Galileo, GLONASS, GPS 802.11 b
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Cut Tape
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Cut Tape

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Quectel 多协议模块 Wi-Fi 4 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, ultra-compact LCC package, USB 2.0 interface only, antenna pin interface

Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -20 C to +70 C, compact LCC package, USB 2.0 interface only, antenna pin interface
Reel, Cut Tape
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 Module, Vela IF310, Trace Pin, Tape and Reel
Vela IF310 2.402 GHz to 2.48 GHz 10 dBm UART 3 V 4.8 V - 40 C + 85 C 16 mm x 12 mm x 2 mm Bluetooth Reel
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, Tape and Reel
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Tape and Reel
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, 8M PSRAM, 8M Flash, RF Trace Pin, Tape and Reel
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, Tape and Reel
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel