-ar 多协议模块

结果: 197
选择 图像 零件编号
 制造商
描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 系列
频率
输出功率
接口类型
电源电压-最小
电源电压-最大
最小工作温度
最大工作温度
天线连接器类型
尺寸
协议 - 蓝牙、BLE - 802.15.1
协议 - 蜂窝、Nbiot、LTE
协议 - GPS、GLONASS
协议 - Sub GHz
协议 - WiFi - 802.11
协议 - ANT、Thread、Zigbee - 802.15.4
封装
Quectel BG95M9LATEA-64-SGNS
Quectel 多协议模块 Embedded, 600-960, 1427.9-1495.9, 1710-2170, 2300-2700 , LTE (4G) , PCB with cable, 75 +/-3 , RF1, Adhesive, 50 25 0.85
数据表
无库存交货期 5 周
最低： 1
倍数： 1
23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel BG95M6LASTEA-64-SGNS
Quectel 多协议模块
数据表
无库存交货期 5 周
最低： 1
倍数： 1

23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel BG95M6LCTEA-64-SAGM
Quectel 多协议模块
数据表
无库存交货期 5 周
最低： 1
倍数： 1

23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel BG95M8LATEA-64-SGNS
Quectel 多协议模块 Embedded, 600-6000, 5G, FPC with cable, 184 +/-3, IPEX ?, Adhesive, 90.15 15.2 0.13
数据表
无库存交货期 5 周
最低： 1
倍数： 1
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Quectel BG773AGLAA-N06-SGNSA
Quectel 多协议模块 Cat M1/Cat NB2 - iSIM + GNSS (w/o WWAN concurrency)
数据表
无库存交货期 16 周
最低： 500
倍数： 500
卷轴: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GNSS Reel
Quectel BG773AGLAA-N06-TA0AA
Quectel 多协议模块
数据表
无库存交货期 5 周

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GNSS
Silicon Labs 多协议模块 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
数据表

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Arduino 多协议模块 Portenta Proto Kit VE ABX00042; ASX00055; TPX00200; ABX00051; ABX00089

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C LTE Cat.4, 4G GNSS Bulk
Arduino 多协议模块 Portenta Proto Kit ME ABX00042; ASX00055; TPX00200; ABX00050
数据表

Portenta CAN, Ethernet, I2C, SPI, USB 7 VDC 30 VDC - 40 C + 85 C Bluetooth 5.0 LTE Cat.4, 4G GNSS Bulk
Murata Electronics 多协议模块 Type 2FP is NXP RW610 based Hostless dual band Wi-Fi 6 + BLE 5.4 Module
数据表
260 MHz 12 dBm 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.55 mm Bluetooth WiFi Reel, Cut Tape
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape (Infineon ARM Cortex 33 Airoc CYW55912)
数据表
更多信息可用

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多协议模块 Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55913)
数据表
更多信息可用
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio 多协议模块 Wi-Fi Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55912)
数据表
更多信息可用

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Silicon Labs 多协议模块 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
数据表

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel

Embedded Artists 多协议模块 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV
数据表

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Ezurio 多协议模块 Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip, Trace Pin
数据表
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
数据表

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel
Ezurio 多协议模块 Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip
数据表
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio 多协议模块 Bluetooth Module, BL54L10, Bluetooth LE, nRF54L10 chip, Trace ANT
数据表
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel
Inventek 多协议模块
数据表

2.4 GHz 17 dBm I2S, SPI, UART 2 V 3.6 V - 40 C + 85 C u.FL 10 mm x 10 mm BLE, Bluetooth 5.1 802.11 b/g/n Reel
Ezurio 多协议模块 Bluetooth Module, BL54L10, Bluetooth LE, nRF54L10 chip, MHF4, T&R
数据表
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel
Fanstel 多协议模块 nRF5340 BLE 5.4 and nRF7002 WiFi 6 combo modules, 2 chip antennas
数据表

2.4 GHz, 5 GHz 3 dBm, 19 dBm GPIO, I2C, QSPI, SPI, SWD, UART, USB 2.0 3.3 V 3.3 V - 40 C + 85 C Chip 24.5 mm x 15.5 mm BLE 802.11 a/b/g/n/ac/ax 802.15.4 Reel
Ezurio 多协议模块 Wi-Fi Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55912)
数据表
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Wi-Fi Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55913)
数据表
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel
Ezurio 多协议模块 Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55912)
数据表
IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Reel