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多协议模块 AI7931LD - 多协议模块 WIFI6 Dual Band 2.4/5GHz M33 SoC Module
- AI7931LD
- AcSiP
-
1:
¥107.5308
-
122库存量
|
Mouser 零件编号
99-AI7931LD
|
AcSiP
|
多协议模块 AI7931LD - 多协议模块 WIFI6 Dual Band 2.4/5GHz M33 SoC Module
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122库存量
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最低： 1
倍数： 1
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WIFI
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300 MHz
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ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART
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2.97 V
|
3.63 V
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- 40 C
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+ 85 C
|
|
32 mm x 32 mm x 2.7 mm
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Bluetooth 5.0
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802.11 a/b/g/n/ac/ax
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Bag
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多协议模块 AI7933CLD - 多协议模块 WIFI6+DSP Dual Band 2.4/5GHz M33 SoC Module
- AI7933CLD
- AcSiP
-
1:
¥124.074
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226库存量
|
Mouser 零件编号
99-AI7933CLD
|
AcSiP
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多协议模块 AI7933CLD - 多协议模块 WIFI6+DSP Dual Band 2.4/5GHz M33 SoC Module
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226库存量
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最低： 1
倍数： 1
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WIFI
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300 MHz
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ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART
|
2.97 V
|
3.63 V
|
- 40 C
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+ 85 C
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32 mm x 32 mm x 2.7 mm
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Bluetooth 5.2
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802.11 a/b/g/n/ac/ax
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Bag
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多协议模块 Wi-Fi Module, Veda SL917, 8MB Flash, SoC, Integrated Antenna, SiWx917, Tape and Reel
- 453-00222R
- Ezurio
-
1:
¥67.4158
-
663库存量
-
新产品
|
Mouser 零件编号
239-453-00222R
新产品
|
Ezurio
|
多协议模块 Wi-Fi Module, Veda SL917, 8MB Flash, SoC, Integrated Antenna, SiWx917, Tape and Reel
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663库存量
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|
最低： 1
倍数： 1
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Veda SL917
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2.4 GHz
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|
I2C, SPI, UART
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1.8 V
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3.3 V
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- 40 C
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+ 85 C
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Chip
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21.1 mm x 16 mm x 2.3 mm
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Bluetooth 5.4, Bluetooth LE
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WiFi 6, 802.11 b/g/n/ax
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Reel, Cut Tape
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多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
- ML3219D-MERCURY-M0-PA11
- Telink
-
1:
¥55.3361
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6库存量
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新产品
|
Mouser 零件编号
141-ML3219DMERCM0PE1
新产品
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Telink
|
多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
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6库存量
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¥55.3361
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¥50.7031
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¥46.1605
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¥41.5275
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查看
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¥38.7929
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|
|
¥36.8041
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¥35.4029
|
|
最低： 1
倍数： 1
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ML3
|
2.4 GHz to 2.483 GHz
|
8.4 dBm
|
I2C, SPI, UART
|
1.8 V
|
4.3 V
|
- 40 C
|
+ 125 C
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26 mm x 11.3 mm x 2.6 mm
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Zigbee
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Reel
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|
多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
- ML7218D1-MERCURY-M0-PE11
- Telink
-
1:
¥124.074
-
6库存量
-
新产品
|
Mouser 零件编号
141-ML7218D1MERM0PE1
新产品
|
Telink
|
多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
|
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6库存量
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¥124.074
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¥109.9264
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|
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¥102.4006
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¥94.7053
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查看
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¥90.1627
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|
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¥87.349
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¥84.2867
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最低： 1
倍数： 1
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|
ML7
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2.4 GHz to 2.483 GHz
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8.5 dBm
|
I2C, SPI, UART
|
1.8 V
|
4.3 V
|
- 40 C
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+ 85 C
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26 mm x 11.3 mm x 2.6 mm
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Reel
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多协议模块 XIAO ESP32S3 - 2.4GHz WiFi, BLE 5.0, Dual-Core, Battery Charge,Smart Homes, IoT, Wearable Devices, Robotics
- 113991114
- Seeed Studio
-
1:
¥61.9579
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1,138库存量
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1,189预期 2026/3/23
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Mouser 零件编号
713-113991114
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Seeed Studio
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多协议模块 XIAO ESP32S3 - 2.4GHz WiFi, BLE 5.0, Dual-Core, Battery Charge,Smart Homes, IoT, Wearable Devices, Robotics
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1,138库存量
1,189预期 2026/3/23
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最低： 1
倍数： 1
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2.4 GHz
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I2C, SPI, UART
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|
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- 40 C
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+ 85 C
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21 mm x 17.5 mm
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802.11 b/g/n
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多协议模块 2.4/5 GHz 72Mbps 3.3V/1.8V
- SX-ULPGN-BTZ-2000
- Silex Technology
-
3,024:
¥150.29
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无库存
|
Mouser 零件编号
702-SX-ULPGN-BTZ2000
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Silex Technology
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多协议模块 2.4/5 GHz 72Mbps 3.3V/1.8V
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无库存
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最低： 3,024
倍数： 3,024
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SX-ULPGN-BTZ
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2.4 GHz, 5 GHz
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17 dBm
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ADC, GPIO, HSUART, I2C, I2S, SDIO, SPI, USB
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1.8 V, 3.3 V
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1.8 V, 3.3 V
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- 20 C
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+ 80 C
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Integrated
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28.5 mm x 33.5 mm x 4.5 mm
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BLE
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802.11 a/b/g/n
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802.15.4 (ANT, Thread, Zigbee)
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Tray
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多协议模块 802.11ac+Bluetooth SDIO card SoC
- SX-SDCAC-2832+ R2
- Silex Technology
-
1:
¥578.6843
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无库存交货期 30 周
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Mouser 零件编号
702-SX-SDCAC-2832+
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Silex Technology
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多协议模块 802.11ac+Bluetooth SDIO card SoC
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无库存交货期 30 周
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¥578.6843
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¥539.5524
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¥500.6013
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最低： 1
倍数： 1
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SX-PCEAC2
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2.4 GHz, 5 GHz
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SDIO
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3.135 V
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3.465 V
|
- 40 C
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+ 85 C
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MHF4
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24 mm x 51 mm x 5.8 mm
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Bluetooth 5.0
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802.11 a/b/g/n/ac
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Bulk
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多协议模块 The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent for
- SX-SDCAC-2832+ R2 SP
- Silex Technology
-
1:
¥560.6495
-
无库存交货期 30 周
|
Mouser 零件编号
702-SX-SDCAC2832R2SP
|
Silex Technology
|
多协议模块 The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent for
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无库存交货期 30 周
|
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¥560.6495
|
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|
¥524.6703
|
|
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¥464.0345
|
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最低： 1
倍数： 1
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Bulk
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多协议模块 Wi-Fi Module, Veda SL917, 8MB Flash, SoC, Trace Pad, SiWx917, Tape and Reel
- 453-00220R
- Ezurio
-
受限供货情况
-
新产品
|
Mouser 零件编号
239-453-00220R
新产品
|
Ezurio
|
多协议模块 Wi-Fi Module, Veda SL917, 8MB Flash, SoC, Trace Pad, SiWx917, Tape and Reel
|
|
|
|
|
|
|
Veda SL917
|
2.4 GHz
|
|
I2C, SPI, UART
|
1.8 V
|
3.3 V
|
- 40 C
|
+ 85 C
|
Chip
|
21.1 mm x 16 mm x 2.3 mm
|
Bluetooth 5.4, Bluetooth LE
|
WiFi 6, 802.11 b/g/n/ax
|
|
Reel, Cut Tape
|
|
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多协议模块 Seeed Studio XIAO ESP32C3
- 113991054
- Seeed Studio
-
受限供货情况
|
Mouser 零件编号
713-113991054
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Seeed Studio
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多协议模块 Seeed Studio XIAO ESP32C3
|
|
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2.4 GHz
|
|
I2C, SPI, UART
|
|
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- 40 C
|
+ 85 C
|
|
21 mm x 17.5 mm
|
|
802.11 b/g/n
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多协议模块 Wi-Fi Module, Veda SL917, 8MB Flash, SoC, Trace Pad, SiWx917, Cut Tape
- 453-00220C
- Ezurio
-
受限供货情况
-
新产品
|
Mouser 零件编号
239-453-00220C
新产品
|
Ezurio
|
多协议模块 Wi-Fi Module, Veda SL917, 8MB Flash, SoC, Trace Pad, SiWx917, Cut Tape
|
|
|
|
|
|
|
Veda SL917
|
2.4 GHz
|
|
I2C, SPI, UART
|
1.8 V
|
3.3 V
|
- 40 C
|
+ 85 C
|
Chip
|
21.1 mm x 16 mm x 2.3 mm
|
Bluetooth 5.4, Bluetooth LE
|
WiFi 6, 802.11 b/g/n/ax
|
|
Reel
|
|
|
|
多协议模块 Wi-Fi Module, Veda SL917, 8MB Flash, SoC, Integrated Antenna, SiWx917, Cut Tape
- 453-00222C
- Ezurio
-
受限供货情况
-
新产品
|
Mouser 零件编号
239-453-00222C
新产品
|
Ezurio
|
多协议模块 Wi-Fi Module, Veda SL917, 8MB Flash, SoC, Integrated Antenna, SiWx917, Cut Tape
|
|
|
|
|
|
|
Veda SL917
|
2.4 GHz
|
|
I2C, SPI, UART
|
1.8 V
|
3.3 V
|
- 40 C
|
+ 85 C
|
Chip
|
21.1 mm x 16 mm x 2.3 mm
|
Bluetooth 5.4, Bluetooth LE
|
WiFi 6, 802.11 b/g/n/ax
|
|
Reel
|
|
|
|
多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
- ML7218A-GAIA-M0-PE11
- Telink
-
受限供货情况
-
新产品
|
Mouser 零件编号
141-ML7218AGAIAM0PE1
新产品
|
Telink
|
多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
|
|
|
|
|
|
|
ML7
|
2.4 GHz to 2.483 GHz
|
8.5 dBm
|
I2C, SPI, UART
|
1.8 V
|
4.3 V
|
- 40 C
|
+ 85 C
|
|
35.29 mm x 18 mm x 2.6 mm
|
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Reel
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