ACCESSORY 单板计算机外壳

结果: 33
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 类型 材料 外盖颜色 长度 宽度 高度 IP 等级 可燃性等级 系列
Hammond Manufacturing 单板计算机外壳 1455NS OPEN BEZEL PKG OF 2

Accessories Open Bezel Plastic 1455
Hammond Manufacturing 单板计算机外壳 1455NS E/P BLACK, PK OF 10

Accessories End Panel Aluminum 1455
ADLINK Technology AMSTX-CF CPU Backing Plate
ADLINK Technology 单板计算机外壳 1.32-50015-0100-A02.Retention, Material=SPCC t=2.0mm,Extrude M3.0xP0.503.Mylar with adhesive4.Backplate_75x75mm5.nut step=6.0mm
Accessories CPU Backing Plate
DFRobot 单板计算机外壳 Metal Cooling Case with Heat Sink (Compatible with Raspberry Pi CM4 IoT Router Carrier Board)

Cases Metal Cooling Case Aluminum 69 mm 59 mm 29 mm
DFRobot 单板计算机外壳 Full-Metal Case for Raspberry Pi 5 Single Board Computer

Cases Full Metal Case 92 mm 66 mm 40 mm
DFRobot 单板计算机外壳 Aluminum Case for Raspberry Pi 5 Single Board Computer

Cases Aluminum Case Aluminum 95 mm 63 mm 45 mm
ADLINK Technology AmSTX-CF Large EPE Bottom
ADLINK Technology 单板计算机外壳 Size: 256x243x81mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: Pink.ESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms
Accessories Large EPE Bottom Expanded Polyethylene (EPE)
ADLINK Technology AmSTX-CF Large EPE Top
ADLINK Technology 单板计算机外壳 Size: 256x243x50mm; Material: EPE with ANTI-STATIC; Density: 22.5KG/M3+/-10%; Color: PinkESD Dissipative Packaging (Outside) =1.0x104 to <1.0x1011ohms
Accessories Large EPE Top Expanded Polyethylene (EPE)