Nexcom 最新模块化计算机 - COM
已应用过滤器:
Ka-Ro Electronics QSMP2 Solder-Down Computer On Modules
03/21/2025
03/21/2025
Feature up to 60x 3.3V general purpose I/O and LVDS display interface.
Advantech SOM-7533 COM Express® Mini Type10模块
01/30/2025
01/30/2025
搭载Intel® Core™ i3、N系列和Atom® x7000系列处理器 (Alder Lake-N/Amston Lake)。
Ka-Ro Electronics QSMP135 Computer-on-Module
07/01/2024
07/01/2024
A solder-down System-on-Module featuring an STM32MP135C 650MHz Arm® Cortex®-A7 processor.
NexCOBOT ICES622X Computer-On-Module (COM)
03/23/2024
03/23/2024
COM Express Type 6 compact-size module that features Intel® Atom™ X6000 processors.
NexCOBOT SMC250 SMARC 2.1 Computer-On-Module (COM)
01/17/2024
01/17/2024
Features an Intel Atom® x5-E3940 Quad Core processor in an 82mm x 50mm short-size module dimension.
Ka-Ro Electronics QFN Style Solder-Down Computer On Modules
01/07/2024
01/07/2024
Single-sided assembled in a small square size of 27mm and a height of 2.6mm.
Ka-Ro Electronics TX91 Computer On Module
01/07/2024
01/07/2024
Complete computer implemented on a board smaller than a credit card.
Ka-Ro Electronics TXMP2 Computer On Module
01/07/2024
01/07/2024
Part of the TX family and includes an STM32MP255 processor with 1.5 GHz dual Arm® Cortex®-A35.
NexCOBOT ICES676S Computer-On-Module (COM)
11/09/2023
11/09/2023
COM Express Type 6-pinouts basic module that supports 12/13th Generation Intel® Core™ processors.
Ka-Ro Electronics TX93 Computer-on-Module (COM)
07/20/2023
07/20/2023
Features a 1.5GHz Dual ARM® Cortex®-A55 processor based on the NXP i.MX 93.
Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module
07/20/2023
07/20/2023
100-pin QFN lead-styled module measures 27mm2 x 2.6mm in height and provides a single-sided assembly
congatec COMe-cAP6 COM Express® w/ Intel® Core™ Processors
04/01/2023
04/01/2023
Boasts the power of 12th Generation Intel Core Processors, supporting up to 64GByte LPDDR5 memory.
ADLINK Technology cExpress-TL COM Express Type 6模块
02/02/2023
02/02/2023
支持PCI Express第4代 (16GT/s) 和四个USB 3.2端口（传输速率高达10Gb/s）。
ADLINK Technology Express-TL COM Express基本尺寸Type 6模块
02/02/2023
02/02/2023
基于第11代Intel® Core™ 、Xeon® W和Celeron® 6000处理器。
congatec 3.5” SBC with AMD RYZEN™ V1000/R1000 Processors
09/01/2022
09/01/2022
A compact single-board computer that excels in 4K playback.
congatec COMe-bID7 COM Express® w/ Intel® XEON® Processors
09/01/2022
09/01/2022
A server-grade platform with exceptional performance.
Ka-Ro Electronics QSRZ Computer-on-Modules
07/01/2022
07/01/2022
Offers a Renesas RZ/G2L Dual 1.2GHz Arm® Cortex®-A55 200MHz Arm Cortex-M33 processor.
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