5G Applications

Eaton Electronics offers an expansive portfolio of high-reliability components needed to drive 5G forward. Because 5G telecommunication units are typically placed in rugged environments, continuous uptime requirements for their operation and the reliability of the internal electronics are of great importance. A variety of components, often passives, can be readily added in key locations within 5G communications systems to enhance reliability and mitigate subcircuits susceptible to electrostatic discharge (ESD), electromagnetic interference (EMI), and electromagnetic pulse (EMP). Eaton 5G products can withstand harsh environments while delivering high performance.

结果: 55
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数量 RoHS ECAD模型 电容
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最大工作温度
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封装
Eaton Electronics 超级电容/超级电容器 0.22F 3.8V 20%
数据表

220 F 3.8 VDC Through Hole 16.5 mm (0.65 in) 27 mm 1000 Hour, 500000 Cycle 100 mOhms - 20 %, + 80 % Vertical EDLC / Supercaps - 15 C + 70 C HS Bulk
Eaton Electronics 超级电容/超级电容器 62.1V 130F XLM (A) Super Cap
数据表

130 F 62.1 VDC Stud Threaded 99.5 mm (3.917 in) 634.9 mm 176.2 mm 1500 Hour 6.7 mOhms 0 %, + 20 % Horizontal EDLC / Supercaps - 40 C + 65 C 173.3 mm XLM Bulk
Eaton Electronics 超级电容/超级电容器 130F 62.1V
数据表

130 F 62.1 VDC Stud Threaded 99.5 mm (3.917 in) 634.9 mm 176.2 mm 1500 Hour 6.7 mOhms 0 %, + 20 % Horizontal EDLC / Supercaps - 40 C + 65 C 173.3 mm XLM Bulk
Eaton Electronics 超级电容/超级电容器 4.17F 259.2V
数据表

4.17 F 259.2 VDC SMD/SMT 550 mm 266 mm 1500 Hour 310 mOhms - 5 %, + 20 % Vertical EDLC / Supercaps - 40 C + 65 C 68.7 mm XVM Bulk
Eaton Electronics 超级电容/超级电容器 6.25F 259.2V
数据表

6.3 F 259.2 VDC SMD/SMT 550 mm 266 mm 1500 Hour 250 mOhms - 5 %, + 20 % Vertical EDLC / Supercaps - 40 C + 65 C 93.7 mm XVM Bulk