ARM Cortex-M33 核心 射频与无线产品

各种射频和无线产品

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
1,229预期 2026/5/27
最低: 1
倍数: 1

Nordic Semiconductor RF片上系统 - SoC Ultra-low power SOC + advanced security features, a range of peripherals & multiprotocol 2.4 GHz transceiver
2,955预期 2027/1/20
最低: 1
倍数: 1
: 3,000

Nordic Semiconductor RF片上系统 - SoC Ultra-low power SOC + advanced security features, a range of peripherals & multiprotocol 2.4 GHz transceiver
1,465预期 2026/10/30
最低: 1
倍数: 1
: 1,500

Nordic Semiconductor RF片上系统 - SoC Ultra-low power SOC + advanced security features, a range of peripherals & multiprotocol 2.4 GHz transceiver
938预期 2027/1/20
最低: 1
倍数: 1
: 1,000

Silicon Labs 多协议模块 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified 无库存交货期 20 周
最低: 2,500
倍数: 2,500
: 2,500

Texas Instruments 射频微控制器 - MCU

Panasonic 蓝牙模块 - 802.15.1 PAN1783A, BLE Module with bottom-pad

Murata Electronics 多协议模块 Type 2FP is NXP RW610 based Hostless dual band Wi-Fi 6 + BLE 5.4 Module
Nordic Semiconductor RF片上系统 - SoC Ultra-low power SOC + advanced security features, a range of peripherals & multiprotocol 2.4 GHz transceiver

Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
Ezurio 多协议模块 Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
Ezurio 多协议模块 Module, BL54L10, Bluetooth LE, Trace ANT, Tape and Reel
Ezurio 多协议模块 Module, BL54L10, Bluetooth LE, MHF4, Tape and Reel
u-blox 蓝牙模块 - 802.15.1 Bluetooth Low Energy stand-alone module,antenna pin for external antenna, Open CPU with CAN FD

u-blox 蓝牙模块 - 802.15.1 Bluetooth Low Energy stand-alone module,embedded PCB trace antenna, Open CPU

Texas Instruments 射频微控制器 - MCU Automotive SimpleLin k Bluetooth 6.0 LE

Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +8 dBm, +125C, 26 GPIO, QFN40

Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +8 dBm, +125C, 26 GPIO, QFN40

Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +4 dBm, DCDC Boost, +55C, 19 GPIO, WLCSP45

Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40

Silicon Labs RF片上系统 - SoC BG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40

Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +8 dBm, +125C, 26 GPIO, QFN40

Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +8 dBm, +125C, 26 GPIO, QFN40

Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40

Silicon Labs RF片上系统 - SoC MG29, 1024kB Flash, 256kB RAM, +6 dBm, DCDC Boost, +55C, 25 GPIO, QFN40