Quectel 多协议模块

结果: 571
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - WiFi - 802.11 封装
Quectel 多协议模块 SC200E with eMCP memory. Recommended to use discrete memory option for better pricing
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Global version, 4+64GB eMCP memory from Samsung
Reel
Quectel 多协议模块 SC200E with discrete memory
Reel
Quectel 多协议模块 SC200E with discrete memory
Reel
Quectel 多协议模块 SC200E with eMCP memory. Recommended to use discrete memory option for better pricing
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 BDS, Galileo, GLONASS, GPS, QZSS, SBAS 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 SC200E with discrete memory
Reel
Quectel 多协议模块 SC200E with eMCP memory. Recommended to use discrete memory option for better pricing
Reel
Quectel 多协议模块 SC200E with eMCP memory
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Longevity till 2030, Linux version
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SDIO, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 Reel
Quectel 多协议模块 cloud enabled, Cat 1 + 3G + 2G, MQTT, 1Gbit ROM+1Gbit RAM, Global
33 dBm ADC, I2C, PCM, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 1 BDS, Galileo, GPS, GLONASS, QZSS Reel
Quectel 多协议模块 cloud enabled, Cat M1/Cat NB2, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency)
21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel 多协议模块 cloud enabled, Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), Data ONLY!
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel 多协议模块 Cat M/ NB/ EGPRS/ NTN module
- 40 C + 85 C 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G, Cost down version of EG25-G, data only, Global
ADC, GPIO, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS Reel
Quectel 多协议模块 Cat 4 + 3G + 2G, Cost down version of EG25-G, data only, MINIPCIE form factor, Global
ADC, GPIO, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-4, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-4 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -20C to +70 C
PCIe - 20 C + 70 C 15 mm x 13 mm x 2.2 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -40 C to +85 C
Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), PCIe interface, 3 antennas (BT 5.2 via separate antenna), -20C to +70 C
PCIe - 20 C + 70 C 15 mm x 13 mm x 2.2 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), 2.4/ 5 GHz dual-band, PCIe interface, 3 antennas (BT 5.2 via separate antenna), -40 C to +85 C
Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ax, 2 2 (2T2R), SDIO interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -20 C to +70 C
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ax, 2 2 (2T2R), SDIO interface, 3 antennas (BT 5.2 has a separate antenna), -20 C to +70 C
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 15 mm x 13 mm x 2 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 4 & Bluetooth 5.2, dual band 2.4/5GHz, 1x antenna, -40 C to +85 C
2.4 GHz, 5 GHz PCM, SDIO, UART 3 V 3.6 V - 20 C + 70 C 12 mm x 12 mm x 2.5 mm BLE 5.2 802.11 a/b/g/n Reel
Quectel 多协议模块 Wi-Fi 6 and Bluetooth 5.4, Max data rate 600.5Mbps, LCC form factor, -20C to +80C

FCS960K 2.4 GHz, 5 GHz 4 dBm, 18 dBm UART 3 V 3.6 V - 20 C + 80 C 12 mm x 12 mm x 2 mm Bluetooth Wi-Fi Reel