Quectel 多协议模块

结果: 628
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装
Quectel 多协议模块 SC200E with eMCP memory(EAU >2000pcs)
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Longevity till 2030, Linux version (EAU >2000pcs)
2.4 GHz, 5 GHz ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SDIO, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 40.5 mm x 40.5 mm x 2.85 mm Bluetooth 2.1 EDR, Bluetooth 3.0, Bluetooth 4.2, Bluetooth 5.0 LTE Cat 4 Reel
Quectel 多协议模块 cloud enabled, Cat 1 + 3G + 2G, MQTT, 1Gbit ROM+1Gbit RAM, Global
33 dBm ADC, I2C, PCM, SGMII, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C 32 mm x 29 mm x 2.4 mm LTE Cat 1 BDS, Galileo, GPS, GLONASS, QZSS Reel
Quectel 多协议模块 No connectivity. 4+32GB - Industrial temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi /BT variant. 1+8GB - Consumer temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi /BT variant. 8+64GB - Consumer temperature range Do Not promote
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 10 C + 75 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi /BT variant. 1+8GB - Industrial temperature range(EAU >2000pcs)
2.5 GHz, 5 GHz ADC, eDP, GPIO, I2C, MIPI-CSI, MIPI-DSI, LVDS, PWM, SPI, UART, USB 2.0, USB 3.0 3.5 V 3.5 V - 40 C + 85 C 46 mm x 42 mm x 3.15 mm Bluetooth 4.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 (EAU >2000pcs)
Reel
Quectel 多协议模块 (EAU >2000pcs)
2.4 GHz, 5 GHz, 6 GHz ADC, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, PCIe, PWM, SPI, UART, USB 2.0, USB 3.1 3.55 V 4.4 V - 35 C + 75 C 56.5 mm x 42.5 mm x 2.95 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 5G R17 Redcap, 5G SA only, LTE CAT4, miniPCIe FF, Global version (newer PCB revision)
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS Tray
Quectel 多协议模块 5G R17 Redcap, 5G SA only, LTE CAT4, LGA package, Global version (newer PCB revision)
PCIe, PCM, USB 2.0 3.135 V 4.4 V - 30 C + 75 C 5G BDS, Galileo, GLONASS, GPS, QZSS Reel
Quectel 多协议模块 5G Sub-6G, Rel-15, NSA/SA operation, up to 200Mhz bandwidth
ADC, GPIO, I2C, PCIe, SPI, UART, USB 2.0, USB 3.0, UXSGMII 3.3 V 4.3 V - 30 C + 70 C 53 mm x 44 mm x 2.95 mm 5G BDS, Galileo, GLONASS, GPS Reel
Quectel 多协议模块 12+128GB, Wi-Fi/BT version
2.4 GHz, 5 GHz ADC, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, PCIe, PWM, SPI, UART, USB 2.0, USB 3.1, Video 3.55 V 4.4 V 46 mm x 42 mm x 2.95 mm Bluetooth 5.1 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 cloud enabled, Cat M1/Cat NB2, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency)
21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel 多协议模块 cloud enabled, Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), Data ONLY!
850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel
Quectel 多协议模块 Cat M/ NB/ EGPRS/ NTN module
- 40 C + 85 C 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 GNSS Reel, Cut Tape
Quectel 多协议模块 Cat 4 + 3G + 2G, Cost down version of EG25-G, data only, Global
ADC, GPIO, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 32 mm x 29 mm x 2.4 mm LTE Cat 4 GNSS Reel
Quectel 多协议模块 Cat 4 + 3G + 2G, Cost down version of EG25-G, data only, MINIPCIE form factor, Global
ADC, GPIO, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Pad 51 mm x 30 mm x 4.9 mm LTE Cat 4 GNSS Tray
Quectel 多协议模块 cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: IPEX-4, 2MB flash
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C IPEX-4 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Quectel 多协议模块 Wi-Fi 5, 802.11a/ b/ g/ n/ ac, 2 2, DBDC, 2.4/ 5 GHz dual-band, Bluetooth 5.1 (CYW54591) - Replacement for FC80AABMD
2.4 GHz, 5 GHz 1.7 V 4.5 V - 40 C + 85 C 15 mm x 13 mm x 2.2 mm Bluetooth 5.1 802.11a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi 5, 802.11a/ b/ g/ n/ ac, 1 1, 2.4/ 5 GHz dual-band, Bluetooth 5.2, SDIO+UART
2.4 GHz, 5 GHz SDIO, UART - 20 C + 70 C 12 mm x 12 mm x 1.55 mm BLE 5.2 802.11 a/b/g/n/ac Reel
Quectel 多协议模块 Wi-Fi 5, 802.11a/ b/ g/ n/ ac, 1 1, 2.4/ 5 GHz dual-band, Bluetooth 5.2, USB+USB
Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), PCIe interface, 2 antennas (BT 5.2 shares 1 Wi-Fi antenna), -20C to +70 C
PCIe - 20 C + 70 C 15 mm x 13 mm x 2.2 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6, 802.11a/ b/ g/ n/ ac/ ax, 2 2 (2T2R), PCIe interface, 3 antennas (BT 5.2 via separate antenna), -20C to +70 C
PCIe - 20 C + 70 C 15 mm x 13 mm x 2.2 mm BLE 5.2 802.11 a/b/g/n/ac/ax Reel
Quectel 多协议模块 Wi-Fi 6, dual band (2.4 GHz/5 GHz) + Zigbee/Thread + BLE 5.3, ARM Cortex-M33, 260MHz, 8MB Flash, 1.2MB RAM, Antenna: PCB, -40 85C, ultra-compact LCC
2.4 GHz, 5 GHz I2C, SPI 3.14 V 3.46 V - 40 C + 85 C 25.5 mm × 18 mm × 3.16 mm Reel