|
|
MOSFET模块 3-Level 1200 V CoolSiC MOSFET Easy Module
- F3L8MR12W2M1HPB11BPSA1
- Infineon Technologies
-
1:
¥961.9916
-
25库存量
|
Mouser 零件编号
726-F3L8MR12W2M1HPB1
|
Infineon Technologies
|
MOSFET模块 3-Level 1200 V CoolSiC MOSFET Easy Module
|
|
25库存量
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
Si
|
SMD/SMT
|
|
|
|
|
|
IGBT 模块 EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC
- F3L500R12N3H7FB66BPSA1
- Infineon Technologies
-
1:
¥2,466.5075
-
22库存量
-
新产品
|
Mouser 零件编号
726-F3L500R12N3H7FB6
新产品
|
Infineon Technologies
|
IGBT 模块 EconoPACK 3 module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode and NTC
|
|
22库存量
|
|
最低: 1
倍数: 1
|
|
IGBT Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
- F3L8MXTR12C2M2H11BPSA1
- Infineon Technologies
-
1:
¥1,787.3323
-
14库存量
-
15在途量
-
新产品
|
Mouser 零件编号
726-F3L8MXTR12C2M2H1
新产品
|
Infineon Technologies
|
MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
|
|
14库存量
15在途量
|
|
|
¥1,787.3323
|
|
|
¥1,519.3302
|
|
|
报价
|
|
|
报价
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
- F3L8MXTR12C2M2QH11BPSA1
- Infineon Technologies
-
1:
¥1,883.8569
-
18库存量
-
新产品
|
Mouser 零件编号
726-F3L8MXTR12C2M2QH
新产品
|
Infineon Technologies
|
MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, 3-level module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
|
|
18库存量
|
|
|
¥1,883.8569
|
|
|
¥1,600.4755
|
|
|
报价
|
|
|
报价
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
MOSFET模块 EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology
- F413MXTR12C1M2H11BPSA1
- Infineon Technologies
-
1:
¥1,251.4976
-
28库存量
-
新产品
|
Mouser 零件编号
726-F413MXTR12C1M2H1
新产品
|
Infineon Technologies
|
MOSFET模块 EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor and high current PressFIT contact technology
|
|
28库存量
|
|
|
¥1,251.4976
|
|
|
¥1,059.5897
|
|
|
报价
|
|
|
报价
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
- F48MXTR12C2M2H11BPSA1
- Infineon Technologies
-
1:
¥1,787.3323
-
20库存量
-
新产品
|
Mouser 零件编号
726-F48MXTR12C2M2H11
新产品
|
Infineon Technologies
|
MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor and high current PressFIT contact technology
|
|
20库存量
|
|
|
¥1,787.3323
|
|
|
¥1,519.3302
|
|
|
报价
|
|
|
报价
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
- F48MXTR12C2M2QH11BPSA1
- Infineon Technologies
-
1:
¥1,883.8569
-
14库存量
-
新产品
|
Mouser 零件编号
726-F48MXTR12C2M2QH1
新产品
|
Infineon Technologies
|
MOSFET模块 EasyPACK 2C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 8 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
|
|
14库存量
|
|
|
¥1,883.8569
|
|
|
¥1,600.4755
|
|
|
报价
|
|
|
报价
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
MOSFET模块 EasyPACK 2B module with CoolSiC Trench MOSFET and PressFIT / NTC
- FS17MR12W2M1HB11ABPSA2
- Infineon Technologies
-
1:
¥924.1027
-
30库存量
-
新产品
|
Mouser 零件编号
726-FS17MR12W2M1HB11
新产品
|
Infineon Technologies
|
MOSFET模块 EasyPACK 2B module with CoolSiC Trench MOSFET and PressFIT / NTC
|
|
30库存量
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
Si
|
Press Fit
|
|
N-Channel
|
|
|
|
MOSFET模块 EconoDUAL 3 CoolSiC MOSFET 1200 V module
- FF1MR12MM1HB11BPSA1
- Infineon Technologies
-
1:
¥4,877.3512
-
14库存量
-
10预期 2026/4/2
-
新产品
|
Mouser 零件编号
726-FF1MR12MM1HB11BP
新产品
|
Infineon Technologies
|
MOSFET模块 EconoDUAL 3 CoolSiC MOSFET 1200 V module
|
|
14库存量
10预期 2026/4/2
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
MOSFET模块 EASY
- F3L11MR12W2M1B74BOMA1
- Infineon Technologies
-
1:
¥1,102.6088
-
19库存量
|
Mouser 零件编号
726-F3L11MR12W2M1B74
|
Infineon Technologies
|
MOSFET模块 EASY
|
|
19库存量
|
|
|
¥1,102.6088
|
|
|
¥1,099.9533
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
Module
|
N-Channel
|
|
|
|
MOSFET模块 Half-bridge 1200 V CoolSiC MOSFET Easy Module
- FF2MR12W3M1HB11BPSA1
- Infineon Technologies
-
1:
¥4,307.0176
-
16库存量
|
Mouser 零件编号
726-FF2MR12W3M1HB11B
|
Infineon Technologies
|
MOSFET模块 Half-bridge 1200 V CoolSiC MOSFET Easy Module
|
|
16库存量
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
Si
|
SMD/SMT
|
|
|
|
|
|
MOSFET模块 Sixpack 1200 V CoolSiC MOSFET Easy Module
- FS55MR12W1M1HB11NPSA1
- Infineon Technologies
-
1:
¥466.351
-
36库存量
-
48预期 2026/3/26
|
Mouser 零件编号
726-FS55MR12W1M1HB11
|
Infineon Technologies
|
MOSFET模块 Sixpack 1200 V CoolSiC MOSFET Easy Module
|
|
36库存量
48预期 2026/3/26
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
Si
|
|
|
|
|
|
|
MOSFET模块 EASY PACK SIC
- FF08MR12W1MA1B11ABPSA1
- Infineon Technologies
-
1:
¥1,346.3724
-
48库存量
-
48预期 2026/7/14
|
Mouser 零件编号
726-FF08MR12W1MA1B11
|
Infineon Technologies
|
MOSFET模块 EASY PACK SIC
|
|
48库存量
48预期 2026/7/14
|
|
|
¥1,346.3724
|
|
|
¥1,146.1138
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
MOSFET模块 EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
- F413MXTR12C1M2QH11BPSA1
- Infineon Technologies
-
1:
¥1,091.7721
-
30在途量
-
新产品
|
Mouser 零件编号
726-F413MXTR12C1M2QH
新产品
|
Infineon Technologies
|
MOSFET模块 EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology
|
|
30在途量
|
|
|
¥1,091.7721
|
|
|
¥1,087.1391
|
|
最低: 1
倍数: 1
|
|
MOSFET Modules
|
SiC
|
Press Fit
|
|
|
|
|
|
IGBT 模块 HYBRID PACK DRIVE G1 SIC
- FS05MR12A6MA1BBPSA1
- Infineon Technologies
-
12:
¥9,282.8031
-
无库存交货期 44 周
|
Mouser 零件编号
726-FS05MR12A6MA1BBP
|
Infineon Technologies
|
IGBT 模块 HYBRID PACK DRIVE G1 SIC
|
|
无库存交货期 44 周
|
|
最低: 12
倍数: 12
|
|
IGBT Modules
|
SiC, Si
|
|
|
|
|