Renesas Electronics ZSSC3135 系列 传感器接口

结果: 6
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 类型 接口类型 电源电压-最大 电源电压-最小 工作电源电流 最小工作温度 最大工作温度 安装风格 封装 / 箱体 封装
Renesas Electronics ZSSC3135BA1B
Renesas Electronics 传感器接口 WAFER (UNSAWN) - BOX

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3135BA1D
Renesas Electronics 传感器接口 DICE (WAFER SAWN) - WAFFLE PACK

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Waffle
Renesas Electronics ZSSC3135BE1D
Renesas Electronics 传感器接口 DICE (WAFER SAWN) - WAFFLE PACK

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Waffle
Renesas Electronics ZSSC3135BE1C
Renesas Electronics 传感器接口 DICE (WAFER SAWN) - FRAME

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Tray
Renesas Electronics ZSSC3135BA1C
Renesas Electronics 传感器接口 DICE (WAFER SAWN) - FRAME

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Tray
Renesas Electronics ZSSC3135BE1B
Renesas Electronics 传感器接口 WAFER (UNSAWN) - BOX

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack