|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 12KLEs
- M2GL010-TQG144I
- Microchip Technology
-
1:
¥269.1547
-
724在途量
|
Mouser 零件编号
494-M2GL010-TQG144I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 12KLEs
|
|
724在途量
在途量:
364 预期 2026/7/6
360 预期 2026/7/13
|
|
最低: 1
倍数: 1
|
|
|
M2GL010
|
12084 LE
|
912 kbit
|
84 I/O
|
1.14 V
|
1.26 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
TQFP-144
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 27.6KLEs
- M2GL025-VFG256I
- Microchip Technology
-
1:
¥626.4042
-
362在途量
|
Mouser 零件编号
494-M2GL025-VFG256I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 27.6KLEs
|
|
362在途量
在途量:
5 预期 2026/7/13
357 预期 2026/8/3
|
|
最低: 1
倍数: 1
|
|
|
M2GL025
|
27696 LE
|
1.08 Mbit
|
138 I/O
|
1.14 V
|
1.26 V
|
- 40 C
|
+ 100 C
|
667 Mb/s
|
2 Transceiver
|
SMD/SMT
|
LFBGA-256
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 35KLEs
- A3PE3000-FG484I
- Microchip Technology
-
1:
¥4,440.109
-
120预期 2026/6/29
|
Mouser 零件编号
494-A3PE3000-FG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 35KLEs
|
|
120预期 2026/6/29
|
|
最低: 1
倍数: 1
|
否
|
|
A3PE3000
|
35000 LE
|
504 kbit
|
341 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-484
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 700LEs
- A3P060-VQG100
- Microchip Technology
-
1:
¥92.3888
-
581预期 2026/7/28
|
Mouser 零件编号
494-A3P060-VQG100
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 700LEs
|
|
581预期 2026/7/28
|
|
最低: 1
倍数: 1
|
|
|
A3P060
|
700 LE
|
18 kbit
|
71 I/O
|
1.425 V
|
1.575 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
VQFP-100
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 SXA FPGA, 12K System Gates
- A54SX08A-TQG100
- Microchip Technology
-
1:
¥636.416
-
90预期 2026/6/18
|
Mouser 零件编号
494-A54SX08A-TQG100
|
Microchip Technology
|
FPGA - 现场可编程门阵列 SXA FPGA, 12K System Gates
|
|
90预期 2026/6/18
|
|
最低: 1
倍数: 1
|
|
|
A54SX08A
|
512 LE
|
0 bit
|
81 I/O
|
2.25 V
|
5.25 V
|
0 C
|
+ 70 C
|
|
|
SMD/SMT
|
TQFP-100
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO FPGA, 7KLEs
- AGL600V5-FGG256I
- Microchip Technology
-
1:
¥956.771
-
90预期 2026/7/28
|
Mouser 零件编号
494-AGL600V5-FGG256I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO FPGA, 7KLEs
|
|
90预期 2026/7/28
|
|
|
¥956.771
|
|
|
¥941.7194
|
|
|
查看
|
|
|
报价
|
|
最低: 1
倍数: 1
|
|
|
AGL600V5
|
7000 LE
|
108 kbit
|
177 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-256
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 6KLEs
- M2GL005-1TQG144I
- Microchip Technology
-
1:
¥147.239
-
90预期 2026/6/29
|
Mouser 零件编号
494-M2GL005-1TQG144I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 6KLEs
|
|
90预期 2026/6/29
|
|
最低: 1
倍数: 1
|
|
|
M2GL005
|
6060 LE
|
703 kbit
|
84 I/O
|
1.14 V
|
1.26 V
|
- 40 C
|
+ 100 C
|
667 Mb/s
|
|
SMD/SMT
|
TQFP-144
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 6KLEs
- M2GL005-TQG144I
- Microchip Technology
-
1:
¥130.3568
-
234预期 2026/7/13
|
Mouser 零件编号
494-M2GL005-TQG144I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 6KLEs
|
|
234预期 2026/7/13
|
|
最低: 1
倍数: 1
|
|
|
M2GL005
|
6060 LE
|
703 kbit
|
84 I/O
|
1.14 V
|
1.26 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
TQFP-144
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 56.5KLEs
- M2GL060-FGG676I
- Microchip Technology
-
1:
¥1,092.8456
-
80预期 2026/8/3
|
Mouser 零件编号
494-M2GL060-FGG676I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 56.5KLEs
|
|
80预期 2026/8/3
|
|
最低: 1
倍数: 1
|
|
|
M2GL060
|
56520 LE
|
1.78 Mbit
|
387 I/O
|
1.14 V
|
1.26 V
|
- 40 C
|
+ 100 C
|
667 Mb/s
|
4 Transceiver
|
SMD/SMT
|
FBGA-676
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 56.5KLEs
- M2GL060T-FGG484I
- Microchip Technology
-
1:
¥1,130.8927
-
60预期 2026/8/3
|
Mouser 零件编号
494-M2GL060T-FGG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 56.5KLEs
|
|
60预期 2026/8/3
|
|
|
¥1,130.8927
|
|
|
¥1,130.8136
|
|
|
¥1,055.6234
|
|
|
查看
|
|
|
报价
|
|
最低: 1
倍数: 1
|
|
|
M2GL060T
|
56520 LE
|
1.78 Mbit
|
267 I/O
|
1.14 V
|
1.26 V
|
- 40 C
|
+ 100 C
|
667 Mb/s
|
4 Transceiver
|
SMD/SMT
|
FBGA-484
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, ARM Cortex-M1, 35KLEs
- M1A3PE3000-2FG484I
- Microchip Technology
-
1:
¥5,246.3414
-
231在途量
|
Mouser 零件编号
494-3PE30002FG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, ARM Cortex-M1, 35KLEs
|
|
231在途量
在途量:
111 预期 2026/7/24
120 预期 2026/8/24
|
|
最低: 1
倍数: 1
|
否
|
|
M1A3PE3000
|
35000 LE
|
504 kbit
|
341 I/O
|
1.14 V
|
1.575 V
|
- 40 C
|
+ 85 C
|
|
|
SMD/SMT
|
FBGA-484
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 Low Power FPGA, 35KLEs
- A3PE3000L-FG484I
- Microchip Technology
-
1:
¥9,461.1397
-
34预期 2026/9/23
|
Mouser 零件编号
494-A3PE3000L-FG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 Low Power FPGA, 35KLEs
|
|
34预期 2026/9/23
|
|
最低: 1
倍数: 1
|
否
|
|
A3PE3000L
|
35000 LE
|
504 kbit
|
341 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-484
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
- A3P250-FGG144
- Microchip Technology
-
1:
¥174.3703
-
480在途量
|
Mouser 零件编号
494-A3P250-FGG144
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
|
|
480在途量
在途量:
320 预期 2027/1/15
160 预期 2027/1/21
|
|
最低: 1
倍数: 1
|
|
|
A3P250
|
3000 LE
|
36 kbit
|
97 I/O
|
1.425 V
|
1.575 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
FBGA-144
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
- A3P250-FGG256
- Microchip Technology
-
1:
¥216.3046
-
90预期 2027/1/15
|
Mouser 零件编号
494-A3P250-FGG256
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
|
|
90预期 2027/1/15
|
|
最低: 1
倍数: 1
|
|
|
A3P250
|
3000 LE
|
36 kbit
|
157 I/O
|
1.425 V
|
1.575 V
|
0 C
|
+ 85 C
|
|
|
SMD/SMT
|
FBGA-256
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
- A3P250-FGG256I
- Microchip Technology
-
1:
¥248.5661
-
180预期 2027/2/18
|
Mouser 零件编号
494-A3P250-FGG256I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
|
|
180预期 2027/2/18
|
|
最低: 1
倍数: 1
|
|
|
A3P250
|
3000 LE
|
36 kbit
|
157 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-256
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 eX FPGA, 3K System Gates
- EX64-TQG64I
- Microchip Technology
-
1:
¥295.8792
-
157预期 2026/6/29
|
Mouser 零件编号
494-EX64-TQG64I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 eX FPGA, 3K System Gates
|
|
157预期 2026/6/29
|
|
最低: 1
倍数: 1
|
|
|
EX64
|
128 LE
|
0 bit
|
41 I/O
|
2.3 V
|
2.7 V
|
- 40 C
|
+ 85 C
|
|
|
SMD/SMT
|
TQFP-64
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 56KLEs
- M2GL050-VFG400I
- Microchip Technology
-
1:
¥946.6801
-
90预期 2027/2/16
|
Mouser 零件编号
494-M2GL050-VFG400I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 56KLEs
|
|
90预期 2027/2/16
|
|
最低: 1
倍数: 1
|
|
|
M2GL050
|
56340 LE
|
1.78 Mbit
|
207 I/O
|
1.14 V
|
1.26 V
|
- 40 C
|
+ 100 C
|
667 Mb/s
|
4 Transceiver
|
SMD/SMT
|
LFBGA-400
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 7.8Mb 8 TransCh 250Mbps-12.7Gbps
- MPF100T-1FCG484I
- Microchip Technology
-
1:
¥1,682.8525
-
43预期 2026/10/5
|
Mouser 零件编号
494-MPF100T-1FCG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 7.8Mb 8 TransCh 250Mbps-12.7Gbps
|
|
43预期 2026/10/5
|
|
最低: 1
倍数: 1
|
|
|
MPF100T
|
109000 LE
|
7.6 Mbit
|
296 I/O
|
970 mV/1.02 V
|
1.03 V/1.08 V
|
|
|
|
|
SMD/SMT
|
BGA-484
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 7.8Mb 8 TransCh 250Mbps-12.7Gbps
- MPF100T-FCG484E
- Microchip Technology
-
1:
¥1,202.1166
-
17预期 2026/7/30
|
Mouser 零件编号
494-MPF100T-FCG484E
|
Microchip Technology
|
FPGA - 现场可编程门阵列 7.8Mb 8 TransCh 250Mbps-12.7Gbps
|
|
17预期 2026/7/30
|
|
最低: 1
倍数: 1
|
|
|
MPF100T
|
109000 LE
|
7.6 Mbit
|
296 I/O
|
970 mV
|
1.08 V
|
0 C
|
+ 100 C
|
12.5 Gb/s
|
4 Transceiver
|
SMD/SMT
|
BGA-484
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 7.8Mb 8 TransCh 250Mbps-12.7Gbps
- MPF100T-FCG484I
- Microchip Technology
-
1:
¥1,442.5693
-
41预期 2026/7/30
|
Mouser 零件编号
494-MPF100T-FCG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 7.8Mb 8 TransCh 250Mbps-12.7Gbps
|
|
41预期 2026/7/30
|
|
最低: 1
倍数: 1
|
|
|
MPF100T
|
109000 LE
|
7.6 Mbit
|
296 I/O
|
970 mV
|
1.08 V
|
- 40 C
|
+ 100 C
|
12.5 Gb/s
|
4 Transceiver
|
SMD/SMT
|
BGA-484
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 11KLEs
- A3P1000-FG484I
- Microchip Technology
-
1:
¥958.6807
-
120预期 2026/7/28
|
Mouser 零件编号
494-A3P1000-FG484I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 11KLEs
|
|
120预期 2026/7/28
|
|
最低: 1
倍数: 1
|
否
|
|
A3P1000
|
11000 LE
|
144 kbit
|
300 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-484
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 7KLEs
- A3P600-FG256I
- Microchip Technology
-
1:
¥543.6091
-
110预期 2026/8/3
|
Mouser 零件编号
494-A3P600-FG256I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 7KLEs
|
|
110预期 2026/8/3
|
|
最低: 1
倍数: 1
|
否
|
|
A3P600
|
|
109 kbit
|
177 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-256
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO Nano FPGA, 3KLEs
- AGLN250V2-VQ100I
- Microchip Technology
-
1:
¥305.9701
-
81预期 2026/7/28
|
Mouser 零件编号
494-AGLN250V2-VQ100I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO Nano FPGA, 3KLEs
|
|
81预期 2026/7/28
|
|
|
¥305.9701
|
|
|
¥284.1272
|
|
|
¥251.538
|
|
|
¥216.056
|
|
|
查看
|
|
|
报价
|
|
最低: 1
倍数: 1
|
否
|
|
AGLN250V2
|
3000 LE
|
36 kbit
|
68 I/O
|
1.14 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
VQFP-100
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 56KLEs
- M2GL050-VF400I
- Microchip Technology
-
1:
¥945.9456
-
90预期 2026/8/3
|
Mouser 零件编号
494-M2GL050-VF400I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 IGLOO2 Low Density FPGA, 56KLEs
|
|
90预期 2026/8/3
|
|
最低: 1
倍数: 1
|
否
|
|
M2GL050
|
|
0 bit
|
|
|
|
|
|
|
|
|
LFBGA-400
|
Tray
|
|
|
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
- A3P250-FG256I
- Microchip Technology
-
1:
¥248.5661
-
60预期 2027/2/8
|
Mouser 零件编号
494-A3P250-FG256I
|
Microchip Technology
|
FPGA - 现场可编程门阵列 ProASIC3 FPGA, 3KLEs
|
|
60预期 2027/2/8
|
|
最低: 1
倍数: 1
|
否
|
|
A3P250
|
3000 LE
|
36 kbit
|
157 I/O
|
1.425 V
|
1.575 V
|
- 40 C
|
+ 100 C
|
|
|
SMD/SMT
|
FBGA-256
|
Tray
|
|