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数量 RoHS
ADLINK Technology 散热片 THS-nXBT-BTLow profile heatsink for NanoX-BT with through hole standoffs for top mounting
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无库存交货期 36 周

Advanced Thermal Solutions 散热片 maxiFLOW BGA Heat Sink+Plastic pushPIN, High Performance, Cross-Cut, 40x38x15mm
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无库存交货期 8 周
最低： 1
倍数： 1

Advanced Thermal Solutions 散热片 maxiFLOW BGA Heat Sink+Plastic pushPIN, High Performance, Cross-Cut, 41x45x15mm
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无库存交货期 8 周
最低： 100
倍数： 100

ADLINK Technology 散热片 THSH-cKL-BHigh profile heatsink for cExpress-KL with threaded standoffs for bottom mounting
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4库存量
最低： 1
倍数： 1

ADLINK Technology 散热片 HTS-nXAL-B-I Heatspreader for nanoX-AL (APL-I) with threaded standoffs for bottom mounting 1库存量
最低： 1
倍数： 1

ADLINK Technology HTS-ADP-B
ADLINK Technology 散热片 Heatspreader for Express-ADP with threaded standoffs for bottom mounting
congatec 散热片 Standard passive cooling for Qseven module conga-QA3. All stand-offs are M2.5 threaded.
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congatec 散热片 Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

congatec 散热片 Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded.
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congatec 散热片 Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
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congatec CPU与芯片冷却器 Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
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congatec 散热片 HEATSPREADER FOR conga-QA3 2.7mm
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congatec 散热片 Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.
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congatec 散热片 Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded
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congatec 散热片 Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded
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congatec 散热片 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.
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congatec 散热片 Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
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congatec 散热片 Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
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congatec 散热片 Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded
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congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
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congatec 散热片 Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.
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congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.
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ADLINK Technology HTS-TL-BT
ADLINK Technology 散热片 Heatspreader for Express-TL with through hole standoffs for top mounting
ADLINK Technology HTS-TL-B
ADLINK Technology 散热片 Heatspreader for Express-TL with threaded standoffs for bottom mounting

congatec HPC/sILH-CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
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