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ADLINK Technology THS-nXEL-B-I
ADLINK Technology 散热片 Low profile heatsink for nanoX-EL with threaded standoffs for bottom mounting
ADLINK Technology HTS-ADP-BT
ADLINK Technology 散热片 Heatspreader for Express-ADP with through hole standoffs for top mounting

ADLINK Technology THSH-cTL-B
ADLINK Technology 散热片 High profile heatsink for cExpress-TL with threaded standoffs for bottom mounting

congatec HPC/cALP-HSP-HP-B
congatec 散热片 Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.
congatec TCV2/HSP-HP-B
congatec 散热片 Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.
congatec HPC/cALP-CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
congatec conga-HPC/mRLP-CSP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.

congatec conga-TCR8/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

congatec conga-HPC/mRLP-CSA-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

congatec 散热片 Standard Heat spreader for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole
congatec 散热片 Passive cooling for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

congatec CPU与芯片冷却器 Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

congatec conga-HPC/mRLP-HSP-B
congatec 散热片 Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.

congatec conga-HPC/mRLP-CSA-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.

Wakefield Thermal 液冷板、液冷和热管道 Vapor Chamber, 239.1x54.34x3.203mm, Nickel Plating, No Standoff, 100W Power

Wakefield Thermal 液冷板、液冷和热管道 Vapor Chamber, 56x56x3.0mm, Antioxidant Finish, No Standoff, 60W Power

Wakefield Thermal 液冷板、液冷和热管道 Vapor Chamber, 90x90x5.5mm, Antioxidant Finish, No Standoff, 200W Power

Wakefield Thermal 液冷板、液冷和热管道 Vapor Chamber, 80x80x4.9mm, Antioxidant Finish, No Standoff, 120W Power

Wakefield Thermal 液冷板、液冷和热管道 Vapor Chamber, 185x75x3.0mm, Nickel Plating Finish, No Standoff, 200W Power

Wakefield Thermal 液冷板、液冷和热管道 Vapor Chamber, 140x85x2.5mm, Nickel Plating Finish, No Standoff, 260W Power

ADLINK Technology 散热片 Heatspreader for Express-BD74 with threaded standoffs for bottom mounting
congatec 散热片 Standard passive cooling for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded

congatec CPU与芯片冷却器 Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded
ADLINK Technology 散热片 Heatspreader for Express-BD74 with through hole standoffs for top mounting
ADLINK Technology 散热片 HTS-cBL-BHeatspreader for cExpress-BL with threaded standoffs for bottom mounting