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ADLINK Technology 散热片 THSH-cAL-B-IHigh profile heatsink for cExpress-AL (APL-I) with threaded standoffs for bottom mounting

ADLINK Technology 散热片 THS-cSL-BTLow profile heatsink for cExpress-SL with through hole standoffs for top mounting

congatec CPU与芯片冷却器 Passive cooling for Pico ITX board conga-PA7*For boards with IHS CPU*Four stand-offs threaded M2.5

ADLINK Technology 散热片 THS-cAL-B-ILow profile heatsink for cExpress-AL (APL-I) with threaded standoffs for bottom mounting

congatec 散热片 Standard passive cooling for COM Express Type 6 Compact module conga-TCA5.* for modules with IHS CPU* 6x Threaded type stand-offs

congatec 散热片 Standard passive cooling for Qseven module conga-QA5* For modules with IHS CPU * With bore hole 2.7mm stand-offs.

congatec 散热片 Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread.
congatec 散热片 HEATSPREADER FOR conga-QA3 2.7mm

Advanced Thermal Solutions 散热片 BGA Heat Sink, High Performance, No TIM, TO220, 19x12.8x12.7mm, Standoff

ADLINK Technology 散热片 THSF-cAL-B-IHigh profile heatsink with Fan for cExpress-AL (APL-I) with threaded standoffs for bottom mounting

congatec 散热片 Standard heatspreader for COM Express Type 6 Compact module conga-TCA5.* for modules with IHS CPU* 4x Bored Hole type stand-offs.* 2x Threaded type stand-offs.

congatec 散热片 Heatspreader for Pico ITX board conga-PA7* For boards with IHS CPUs* All standoffs are bore hole 2.7mm
congatec 散热片 Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
Advanced Thermal Solutions 散热片 BGA Heat Sink, High Performance, No TIM, TO220, 30x25.4x12.7mm, Standoff

congatec 散热片 Heatspreader for Pico ITX board conga-PA7* For boards with IHS CPUs* All standoffs are threaded M2.5

congatec 散热片 Standard passive cooling for COM Express Type 6 Compact module conga-TCA5.* for modules with IHS CPU* 4x Bored Hole type stand-offs.* 2x Threaded type stand-offs.

congatec 散热片 Standard heatpipe based heatspreader for high performance COM Express Type 6 module conga-TS170, conga-TS175 and conga-TS370. All stand-offs are M2.5 threaded.

congatec 散热片 Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM processor. All standoffs are with 2.7mm bore hole.

congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors.All standoffs are M2.5x0.45p threaded.
congatec 散热片 Standard heatspreader for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors. All standoffs are M2.5x0.45p threaded.
congatec 散热片 Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.

congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole.
congatec 散热片 Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are M2.5 threaded.
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.

congatec 散热片 Passive cooling for SMARC 2.0 module conga-SA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are bore hole 2.7mm