Bulk CPU与芯片冷却器

结果: 18
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数量 RoHS ECAD模型 高度
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功率额定值
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DFRobot CPU与芯片冷却器 This active cooler is an ultra-thin heatsink specifically designed for the LattePanda IOTA. Its adjustable-speed fan works together with the cooling fins to quickly dissipate heat generated by the processor, keeping the LattePanda board operating at 35库存量
58预期 2026/7/20
最低： 1
倍数： 1

10.45 mm 69 mm 5 VDC
Raspberry Pi CPU与芯片冷却器 Raspberry Pi Compute Module 5 Passive Cooler 5,891库存量
最低： 1
倍数： 1

ADDA CPU与芯片冷却器 DC Chip Cooler, 40x40x8mm, 12VDC, 4.7CFM, 0.06A, 28dBA, 7000RPM, Hypro Bearing
数据表
产品评论
80库存量
最低： 1
倍数： 1

40 mm 40 mm 8 mm 10.8 VDC to 13.2 VDC 684 mW 4.7 CFM (0.13 m3/min) Sleeve AP 40x8
DFRobot CPU与芯片冷却器 Aluminum Active Cooler for LattePanda Mu Compute Module 545库存量
431预期 2026/7/6
最低： 1
倍数： 1

19 mm 50.4 mm 5 VDC 4000 RPM Mu
ADDA CPU与芯片冷却器 DC Chip Cooler, 35x35x8mm, 5VDC, 4.1CFM, 0.13A, 32dBA, Hypro, Lead Wire
数据表
产品评论
15库存量
20预期 2026/11/5
最低： 1
倍数： 1

35 mm 35 mm 8 mm 4.5 VDC to 5.5 VDC 900 mW 10500 RPM 4.1 CFM (0.12 m3/min) Sleeve AP 35x8
congatec conga-HPC/mRLP-CSA-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
数据表

congatec conga-TCR8/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

congatec conga-HPC/mRLP-CSP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
数据表

congatec conga-HPC/mRLP-CSA-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
数据表
更多信息可用

DFRobot CPU与芯片冷却器 ICE Tower Cooler for Raspberry Pi 5 Single Board Computer

40 mm 35 mm Efficient Cooling
Intel BXTSRM1
Intel CPU与芯片冷却器 Intel Laminar RM1 Cooler, Bulk
100 mm 47 mm 100 mm 13 VDC 65 W 3150 RPM PWM
congatec conga-TC700/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
数据表

congatec conga-TC700/CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.
数据表

congatec conga-TC700/CSP-HP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 24.7mm height. All standoffs are with 2.7mm bore hole.
数据表

congatec conga-TC700/CSP-HP-T
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TC700 with integrated heat pipes, 24.7mm height. All standoffs are M2.5mm threaded.
数据表

congatec conga-TCR8/CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded.

congatec conga-TCR8/CSP-HP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole.

congatec conga-TCR8/CSP-HP-T
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded.