KEMET KPS L 系列锡铅端接 X7R SMD MLCC

KEMET KPS L 系列锡铅端接 X7R SMD MLCC 采用专有的引线框架技术,将一个或多个 MLCC 垂直堆叠在单个紧凑的 SMD 封装中。 所附的引线框架通过机械方式隔离电容器与印刷电路板。 因此,具有先进的机械和热应力系统。 施加偏置电压时可听见的颤噪音可通过隔离来屏蔽。 与传统的表面贴装 MLCC 器件相比,双片堆叠将电容值增加一倍,但设计体积相同甚至更小。 具有高达 10mm 的板弯曲能力,KEMET 的锡/铅电镀工艺符合 5% 最小含铅量的要求。了解详情

特性

  • -55°C to +125°C operating temperature range
  • Reliable and robust termination system
  • EIA 1210 and 2220 case sizes
  • 10V, 16V, 25V, 50V, 100V, 250V, 500V and 630V DC voltage ratings
  • 0.047μF up to 47μF capacitance range
  • ±10% and ±20% capacitance tolerance
  • Higher capacitance in the same footprint
  • Potential board space savings
  • Advanced protection against thermal and mechanical stress
  • Provides up to 10mm of board flex capability
  • Reduces audible, microphonic noise
  • Low ESR and ESL
  • SnPb-plated termination finish (5% Pb minimum)
  • Non-polar device, minimizing installation concerns
  • Tantalum and electrolytic alternative

应用

  • Switch-mode power supplies (input filters, resonators, tank circuits, snubber circuits, output filters)
  • High-voltage coupling and DC blocking
  • Lighting ballasts
  • Voltage multiplier circuits
  • DC/DC converters and coupling capacitors in Ćuk converters
  • Smoothing circuits
  • Noise reduction (piezoelectric/mechanical)
  • Circuits with a direct battery or power source connection
  • Critical and safety-relevant circuits without (integrated) current limitation
  • Any application that is subject to high levels of board flexure or temperature cycling
发布日期: 2016-09-16 | 更新日期: 2023-08-23