Laird Tflex™ HR6.5 Thermal Gap Filler
Laird Tflex™ HR6.5 Thermal Gap Filler is a thermal interface material with >6W/mK thermal conductivity and high recovery properties. This filler is designed to withstand cyclic gap changes caused by shock, vibration, or warpage, providing consistent thermal performance throughout the part's life. HR6.5 material provides minimal stress on components, is easily assembled, and, in many cases, can be reused after rework due to its good rebound capability. Laird Tflex HR6.5 Thermal Gap Filler offers a 1mm to 5mm thickness range, ceramic-filled silicon sheet construction, a UL 94V-0 flammability rating, and an operating temperature range of -50°C to +150°C.
Features
- High resiliency and good recovery
- Low peak and residual force
- Low outgassing and oil bleeding
- Good elongation
Applications
- Base stations
- Power amplifiers
- Active antenna units
- Automotive infotainment
- Automotive electronics
- Instrumentation
- Test and measurement
- Computer servers
- Notebooks
- Tablets
- Portable devices
Specifications
- >6.0W/mK thermal conductivity
- 1mm to 5mm thickness range
- 3.2g/cc density
- -50°C to +150°C operating temperature range
- >7KV dielectric breakdown
- UL 94V-0 flammability rating
- >1.1x1014Ω.cm volume resistivity
- RoHS and REACH compliant
Videos
Application Note
发布日期: 2025-09-08
| 更新日期: 2026-07-08