Laird Technologies
Laird Performance Materials设计并开发电子设备保护解决方案，包括EMI抑制、热管理材料、结构和精密金属及多功能产品。材料科学专家能提供更好保护、更高性能和可靠性、定制结构设计并缩短上市时间。
特色产品 Laird Technologies
Tflex™ SF16 Thermal Gap Fillers
Innovative, high-performing thermal materials in the Laird non-silicone-based gap filler portfolio.
MAF06 High-Current Low DCR SMD Power Inductors
Power line noise suppression and desired power efficiency while delivering extremely low DCR.
Tflex™ HR6.5 Thermal Gap Filler
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.
Tflex™ CR550 2-Part Dispensable Gap Filler
Transfers unwanted heat in automotive components and the A+B putty material cures in place.