Winbond特色产品

Addresses the requirement of connected IoT edge devices used in industrial & consumer applications.

采用SDP或DDP封装和基于命令/地址总线的2或4时钟架构。

为5G应用提供一致的4KB扇区和双路/四路SPI输入。

Offered in Single-Die-Package (SDP) and Dual-Die-Package (DDP).

Secure storage solution for systems with limited space, pins and power.

Based on the popular W25Q/W25N SpiFlash® series by stacking W25Q16JV and W25N01GV.

由串行和1.2V NOR闪存组成，非常适合用于消费和工业应用。

Consists of Serial NAND, High-Performance Serial NAND, and SLC NAND Flash.

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