Molex 带锡、银、铋镀层的SMT FFC/FPC连接器
Molex带锡、银、铋镀层的SMT FFC/FPC连接器产品系列是小型FFC/FPC SMT连接器，可满足各种空间和特定应用的需求。锡、银、铋镀层可减少和/或防止锡晶须的产生，提高了相关部件的可靠性。这些连接器长宽高尺寸紧凑，迎合要求紧凑封装的应用。可靠的致动器设计有助于防止因 频繁测试、循环或野蛮装卸造成的损坏。 零插入力（ZIF） 和低插入力（LIF）选项允许反复循环而磨损最小。Molex超小型FFC/FPC有各种精致脚距型号可选，并有低侧高、高密度的特性，可满足电子设备制造商对精简尺寸的需求。 。
特性
- 4 to 50 circuit sizes in top, bottom, and vertical contact points offer design flexibility
- Gold- and tin-plated contact points prevent solder wicking during SMT process
- Compact depth, height, and length offers space savings for mobile device applications
- ZIF and LIF options allow for repeat cycling with minimum wear
- Robust terminal and actuator designs provide higher contact and cable retention reliability
- Sn-Ag-Bi plating reduces and/or prevents the production of tin whiskers to increase reliability of associated part
- Robust solder tabs (nails) offer secure PCB retention and strain relief for solder tail joints
应用
- Medical
- Patient monitoring
- MRI/CT machines
- Disposable inspection devices
- Mobile
- POS terminals
- Consumers
- Home appliances
- Industrial
- IoT interconnection devices
- Smart speakers
- UAVs (drones)
- FA robots
- Security cameras
Related Solutions
Molex Premo-Flex电缆和Easy-On连接器解决方案
完整的扁平柔性连接解决方案，提供0.25mm、0.30mm、0.50mm和1.00mm间距选项。
发布日期: 2013-10-15
| 更新日期: 2025-11-17