Molex Impel™ 背板互连系统

Molex Impel™ 背板互连系统信号完整性和密度在业界领先,同时也为将来的数据速率提升提供了可升级的价格和性能路径。Impel™ 背板互连系统的大小和接口可让客户在无需彻底重新设计体系结构或更换数据中心已有硬件的情况下加快数据速率(40 Gbps),并同时满足业界所需的机械密度要求。Impel™ 背板连接器系统和定制线缆组件使原始设备制造商可以按目前的数据速率和成本来运行其设备。

The Impel Backplane Interconnect System provides the footprint and interface that will enable customers to migrate to faster data rates (40Gbps), without completely re-designing their architecture or replacing hardware already placed in the data-center, while meeting the mechanical density requirements being driven by the industry. The Impel system of backplane connectors and customized cable assemblies offers OEMs the option for equipment to operate at today's data rates and costs

Molex Impel Plus Backplane Connectors expand the system to achieve data rates up to 56Gbps with superior signal integrity performance and forward compatibility with compact compliant pins.

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发布日期: 2014-11-03 | 更新日期: 2022-03-11