Molex SpeedStack平行板连接器系统 - 即将推出
Molex 的 SpeedStack™平行板连接器系统提供高密度薄型解决方案，每个差分线对的数据速率高达 40 Gbps。此连接器具有 4.00 至 10.00 mm 的堆叠高度及 0.80 mm 间距，SpeedStack平行板连接器系统为 PCB 空间受限型应用提供了设计灵活性。薄型 0.800 mm 间距和窄体外壳设计最大限度地减小空气流阻塞并提升系统散热性能。此系统的分隔焊盘 PCB 设计实现了电气调节性能以实现每个差分线对高达 40 Gbps 的数据速率，并提供侧边卡兼容性。SpeedStack 的功能强大的插入成型晶圆设计带有一个保护性遮蔽外壳，支持端子位置以改进薄型高密度系统信号的电气平衡。此外，通用接地引脚改进了电气性能并最大限度地减小了串扰。Molex 的 SpeedStack™平行板连接器系统非常适合具有空间受限 PCB 的应用，如电信、网络、军事、医疗和许多消费设备。
The low-profile 0.80mm pitch and narrow housing design minimize airflow obstructions and promote system cooling. The system's split-pad PCB design allows for electrical tuning performance to achieve data rates up 40 Gbps per differential pair and provides edgecard compatibility.
SpeedStack's robust insert-molded wafer design with protected shrouded housing support the terminal location to improve electrical balance within the signals for low profile, high-density systems. In addition, a common grounding pin improves electrical performance and minimizes cross-talk.
特性
- Mated stack heights 4.00 to 10.00mm with a 0.80mm pitch
- Multiple circuit sizes (22, 60 and 120) with a range of 6 to 32 differential pairs
- Split-pad PCB design
- 100Ω impedance design
- 85Ω impedance versions in development
- Robust insert-molded wafer design with protected shrouded housing
- Low-profile 0.80mm pitch and narrow housing design
- Shielding grounding pins
应用
- Telecommunication Applications
- Remote Radio Antennas
- Base Stations
- Mobile
- Networking
- Servers
- Routers
- Switch
- Storage
- Military and Medical
- Scanning Equipment
- Consumer
- Camera
- Handheld scanners
