ADLINK Technology Express-SL/SLE COM
ADLINK Express-SL/SLE是COM.0 R2.1基本尺寸6型计算机模块，支持64位第6代Intel® Core™、Xeon® E3和Celeron®处理器（以前称为“Skylake-H”），采用Intel® QM170、HM170、CM236 芯片组。Express-SL/SLE具有出色的高性能图形处理能力，缩短开发时间，支持长生命周期。该器件采用Intel超线程技术（多达4内核、8线程）和1866/2133MHz的DDR4双通道内存，由CPU/芯片组组合决定是否支持ECC/非ECC。这种组合确保模块的出色整体性能。通过一个Intel FDI（灵活显示接口）和DMI（直接媒体接口）支持CPU至Intel QM170、HM170、CM236芯片组的高速连接。Intel第9代集成显卡包含OpenGL 4.4/4.3/4.2，DirectX 11，Intel® Clear Video HD技术，Advanced Scheduler 2.0、1.0，支持XPDM，其DirectX视频加速 (DXVA) 支持完整H.265/HEVC、MPEG2硬件编解码器。显卡输出包括LVDS和三个DDI端口，支持HDMI/DVI/DisplayPort和eDP作为构建选项。Express-SL/SLE具有双通道堆叠式SODIMM插槽，最高支持32GB DDR4 ECC（或非ECC）内存。此外，多路复用的PCIe x16显卡总线可用于独立显卡扩展。输入/输出功能包括1个板载千兆以太网端口、8个PCIe x1 Gen3通道、USB 3.0和2.0端口以及SATA 6Gb/s端口。支持SMBus和I²C。带有CMOS备份的SPI AMI EFI BIOS支持远程控制台、硬件监视器、看门狗定时器和该模块的其他嵌入式功能。应用包括自动化、医疗和信息娱乐，工作温度范围宽，可选择用于运输和国防应用。
The integrated Intel Generation 9 Graphics include items such as OpenGL 4.4/4.3/4.2, DirectX 11, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC, MPEG2 hardware codec. Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP as a build option. The Express-SL/SLE has dual stacked SODIMM sockets supporting up to 32GB of DDR4 ECC/non-ECC memory. In addition, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion. Input/output features include a single onboard Gigabit Ethernet port, eight PCIe x1 Gen3 lanes, USB 3.0 and 2.0 ports, and SATA 6Gb/s ports. Support is provided for SMBus and I²C. SPI AMI EFI BIOS with CMOS backup support the remote console, hardware monitor, watchdog timer, and other embedded features of the module. Applications include automation, medical, and infotainment, with an extended operating temperature range optionally available for transportation and defense applications.
特性
- Intel QM170/HM170/CM236 Chipset
- 6th Gen Intel® Core™, Intel® Xeon®, and Celeron® Processor
- Up to 32GB Dual Channel DDR4 at 1867/2133MHz (supports both ECC and non-ECC memory)
- 3x DDI channels, 1x LVDS (or 4 lanes eDP) supports up to 3 independent displays
- 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
- GbE, 4x SATA 6Gb/s, 4x USB 3.0 and 4x USB 2.0
- Supports Smart Embedded Management Agent (SEMA®) functions
- -40°C to +85°C (build option) Extreme Rugged operating temperature
应用
- Automation
- Medical
- Infotainment