Analog Devices Inc. Analog Devices EVAL-ADUM3151Z 评估板
Analog Devices EVAL-ADUM3151Z 评估板帮助设计人员对 ® 数据方向发生变化的 7 通道 SPIsolator 隔离器进行评估 (ADuM3151ARSZ, ADuM3151BRSZ, ADuM3152ARSZ, ADuM3152BRSZ, ADuM3153ARSZ, ADuM3153BRSZ, ADuM4151ARIZ, ADuM4151BRIZ, ADuM4152ARIZ, ADuM4152BRIZ, ADuM4153ARIZ, ADuM4153BRIZ)并针对 SPI 应用进行了优化。它们包含三个用于辅助功能的低速通道，它们对时序要求不高。开发时遵循了印刷电路板(PCB)的 4 层板最佳设计实践，隔离栅两侧分别集成全电源和接地层。EVAL-ADUM3151Z 提供 JEDEC 标准 20 引脚 SSOP 焊盘布局，支持信号分配、回送和以 VDDx 或 GNDx 为参考的负载，以及最优旁路电容。信号源可连接至电路板，也可通过边缘安装型 SMA 连接器（单独出售）或端子板连接电路板，实现电源连接。电路板集成 200 密耳接头位置，可兼容 Tektronix 有源探头。
The EVAL-ADUM3151Z is developed using the printed circuit board (PCB) design practices for 4-layer boards, including a full power and ground plane on each side of the isolation barrier. EVAL-ADUM3151Z offers a JEDEC standard 20-lead SSOP pad layout, support for signal distribution, loopback, and loads referenced to VDDx or GNDx, as well as optimal bypass capacitance. Signal sources can be wired onto the board as well as brought onto the board through edge-mounted SMA connectors (sold separately) or terminal blocks for power connections. The board includes 200 mil header positions for compatibility with Tektronix active probes.
特性
- Full power and ground plane on each side of the isolation barrier
- JEDEC standard 20-lead SSOP pad layout
- Support for signal distribution, loopback
- Loads referenced to VDDx or GNDx
- Optimal bypass capacitance
- 200 mil header positions for compatibility with Tektronix active probes
发布日期: 2014-09-11
| 更新日期: 2022-03-11