英飞凌XENSIV MEMS麦克风即使在高声压级 (SPL) 下也具有超低的自噪声(高SNR)和极低的失真 (THD)。这些麦克风还具有紧密的组件间相位和灵敏度匹配、具有低LFRO(低频滚降)的平坦频率响应,以及超低群延迟。这些MEMS麦克风的上述先进特性,结合可选择的功率模式和小型封装尺寸,使它们成为具有出色音频采集功能的消费性电子产品和预测性维护和安全性等特定工业应用的理想选择。
特性
- 动态范围:105dB
- 信噪比 (SNR):69dB(A)
- <1%总谐波失真达128dBSPL
- 声学过载点:130dBSPL
- 灵敏度 (±1dB) 和相位(1kHz时±2°)匹配
- 在28Hz时具有低频滚降的平坦频率响应
- 非常快的模数转换速度(1kHz时6μs延迟)
- 功率优化模式由PDM时钟频率决定
- 封装尺寸: 4mm x 3mm x 1.2mm
- PDM输出
- 全向拾取模式
应用
- 具有语音用户界面 (VUI) 的设备
- 智能扬声器
- 家居自动化
- 物联网设备
- 主动降噪 (ANC) 耳机
- 高质量音频捕捉
- 会议系统
- 相机和摄录一体机
- 带音频模式检测的工业或家用监控
IM69D128S
Great signal-to-noise ratio (SNR) of 69dB(A) enables a crystal clear audio experience without compromising on battery life. Enabled by a revolutionary digital microphone ASIC, the IM69D128S sets a benchmark by cutting current consumption to 520μA – almost half of what models with similar performance on the market can offer. Additionally, IM69D128S masters the art of switching between different power and performance profiles without any audible artifacts, i.e., glitches that the user can hear.
IM70D122
High performance digital XENSIV MEMS microphone IM70D122 makes the most out of Infineon´s Sealed Dual Membrane technology to meet a very high signal-to-noise ratio of 70dB(A) and a very high sensitivity of -26dBFS. Especially thanks to its high sensitivity and high SNR, the IM70D122 is perfectly tailored for advanced audio capturing, which can uplift the audio experience for laptops, tablets, cameras, and conference systems.
IM73D122
超低噪声数字XENSIV™ MEMS麦克风IM73D122是专为需要极高SNR(低自噪音)和高灵敏度的应用而设计的。它通过平坦的频率响应(20Hz低频滚降)和严格的制造公差,改善了多麦克风(阵列)应用的性能。该麦克风采用英飞凌的密封双膜MEMS技术,可提供麦克风层面的高防护等级 (IP57)。
IM68A130
The IM68A130 is a high-performance, single-ended, analog MEMS microphone designed for applications that require a low LFRO (10Hz), a high SNR (low self-noise), and low distortion (high AOP). The high signal-to-noise ratio (SNR) of 68dB(A) enables far-field and low-volume audio pick-up. The flat frequency response and tight manufacturing tolerance improve the performance of Active Noise Cancellation (ANC) and multi-microphone array applications.
IM70A135
Infineon’s XENSIV MEMS analog microphone IM70A135 is a compact, high-performance microphone with a very high acoustic overload point of 135dBSPL and a size of only 3.50mm x 2.65mm x 1.00mm3. This microphone is based on Infineon’s Sealed Dual Membrane MEMS technology, which delivers high ingress protection (IP57) at a microphone level. The small size makes this microphone especially suited for TWS earbud applications.
IM72D128V01
IM72D128V01是一款超高性能的数字麦克风,专为需要极高SNR(低自噪声)和低失真(高AOP)的应用而设计。该麦克风采用英飞凌的密封双膜MEMS技术,可提供麦克风层面的高防护等级 (IP57)。它通过平坦的频率响应(20Hz低频滚降)和严格的制造公差,改善了多麦克风(阵列)应用的性能。该麦克风可选择不同的功率模式,以满足特定的时钟频率和电流消耗要求。
IM69D127
IM69D127是一款采用英飞凌密封双膜MEMS技术的数字高性能MEMS麦克风,可提供麦克风层面的高防护等级 (IP57)。此器件尺寸小巧,仅为3.60mm x 2.50mm x 1.00mm3,是真无线 (TWS) 耳机等紧凑型音频设备的理想选择。
IM73A135
英飞凌XENSIV™ MEMS模拟麦克风IM73A135具有73dB的信噪比 (SNR) 和135dBSPL的高声学过载点,能清晰地拾取非常安静和非常响亮的声音。IM73A135使设计人员能达到以前只有通过ECM才能实现的高音频性能水平,同时还能获得MEMS技术固有的优势。
Audiohub Nano
英飞凌Audiohub Nano模拟评估板EVAL AHNB ANALOGV01可用于评估英飞凌模拟XENSIV™ MEMS麦克风。该套件包含一个英飞凌Audiohub Nano和柔性板上的四个模拟麦克风。最多可将两个英飞凌模拟XENSIV™ MEMS麦克风以单声道或立体声输出方式连接到评估板。此评估板提供USB音频接口,可使用任何音频录制和编辑软件从麦克风流式传输音频数据。
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