Intel Core™ i3-6100移动处理器

Intel® Core™ i3-6100移动处理器是采用14纳米工艺技术的64位多核处理器。这些器件采用双芯片平台,连接在主板的离散式Intel 100系列芯片组系列平台控制器集线器 (PCH) 上。由于利用微型构架的节能特性,这些器件的处理速度比上一代处理器快。智能电源管理具有Intel Turbo Boost 2.0,可动态控制内核和显卡的性能与功耗,且在需要时精确提升性能并在运行时节能。

特性

  • General Specifications
    • Cache: 3MB SmartCache
    • Bus Speed: 4GT/s OPI
    • Instruction Set: 64-bit
    • Instruction Set Extensions: SSE4.1/4.2, AVX2
    • Embedded Options Available: Yes
    • Lithography: 14nm

  • Performance
    • # of Cores: 2
    • # of Threads: 4
    • Processor Base Frequency: 2.3GHz
    • TDP: 15W
    • Configurable TDP-down Frequency: 800MHz
    • Configurable TDP-down: 7.5W

  • Memory Specifications
    • Max Memory Size (dependent on memory type): 32GB
    • Memory Types: DDR4-2133, LPDDR3-1866, DDR3L-1600
    • # of Memory Channels: 2
    • Max Memory Bandwidth: 34.1GB/s

  • Graphics Specifications
    • Processor Graphics: Intel HD Graphics 520
    • Graphics Base Frequency: 300MHz
    • Graphics Max Dynamic Frequency: 1GHz
    • Graphics Output: eDP/DP/HDMI/DVI
    • 4K Support: Yes at 60Hz
    • Max Resolution (HDMI 1.4): 4096x2304@24Hz
    • Max Resolution (DP): 4096x2304@60Hz
    • Max Resolution (eDP - Integrated Flat Panel): 4096x2304@60Hz
    • DirectX Support: 12
    • OpenGL Support: 4.4
    • Intel Quick Sync Video
    • Intel InTru 3D Technology
    • Intel Clear Video HD Technology
    • Intel Clear Video Technology
    • # of Displays Supported: 3
  • Expansion Options
    • PCI Express Revision: 3.0
    • PCI Express Configurations: 1x4, 2x2, 1x2, 2x1 and 4x1
    • Max # of PCI Express Lanes: 16

  • Package Specifications
    • Sockets Supported: FCBGA1356
    • Max CPU Configuration: 1
    • TJUNCTION: 100ºC
    • Package Size: 42mmx24mm
    • Low Halogen Options Available: See MDDS

  • Advanced Technologies
    • Intel Hyper-Threading Technology
    • Intel Virtualization Technology (VT-x)
    • Intel Virtualization Technology for Directed I/O (VT-d)
    • Intel VT-x with Extended Page Tables (EPT)
    • Intel 64
    • Idle States
    • Enhanced Intel SpeedStep Technology
    • Thermal Monitoring Technologies
    • Intel Flex Memory Access
    • Intel Identity Protection Technology
    • Intel Smart Response Technology
    • Intel My WiFi Technology

  • Security and Reliability
    • Intel AES New Instructions
    • Secure Key
    • Intel Software Guard Extension (Intel SGX)
    • Intel Memory Protection Extensions (Intel® MPX)
    • Execute Disable Bit
    • Intel Boot Guard

Block Diagram

Intel Core™ i3-6100移动处理器
View Results ( 2 ) Page
物料编号 数据表 描述
CL8066202400105S R2DX CL8066202400105S R2DX 数据表 CPU - 中央处理器 64BIT MPU
CL8066201939604S R2DV CL8066201939604S R2DV 数据表 CPU - 中央处理器 64BIT MPU
发布日期: 2017-10-23 | 更新日期: 2022-03-28