iWave Global iW-RainboW-G57M® Versal AI Edge/Prime SOM

iWave Global iW-RainboW-G57M^® Versal AI Edge/Prime System on Module (SOM) is based on the AMD series and is designed to power AI applications from the edge to the endpoint. This module features a dual-core Arm^® Cortex^®-A72 Core and a dual-core Cortex-R5F core and is compatible with an extensive series of Xilinx chips. The iW-RainboW-G57M SOM is integrated with up to 4GB LPDDR4 RAM, 16GB eMMC, and 256MB QSPI flash. This module includes two high-speed expansion connectors and 122 user-configurable IOs, enabling a wide range of user interfaces. The iW-RainboW-G57M Versal AI Edge/Prime SOM provides Edge AI solutions for Advanced Driver-Assistance Systems (ADAS), robotics, medical imaging, LiDAR, and radar applications.

Features

Industrial-grade SOM
High AI inference performance
5V through B2B connector2 power input
SFVA784 package

-40°C to +85°C operating temperature range
50mm x 60mm x 4.8mm form factor
Product longevity of 10 to 15 years
REACH and RoHS 3 compliant

Specifications

SoC
- Xilinx Versal AI Edge/Prime
- Pin compatible with Xilinx VE2302 / VE2202 / VE2102 / VE2002 / VM1102 devices
- Dual ARM Cortex-A72 core processor
- Dual Core ARM Cortex-R5F
- Up to 328K/150K logic cells
- GTYP transceivers x 8 @32Gbps
- 39LVDS pairs and 20SE PL IOs
Dialog’s DA9062 PMIC with RTC
6-bit clock synthesizer
Memory interfaces:
- 64-bit LPDDR4 from PL
- 256MB QSPI flash
- 16GB eMMC flash
Board-to-board connector 1 interfaces (240-pin) from the PL block
- 27LVDS/54SE IOs from BANK 703
- 12LVDS/24SE IOs from BANK 702
- 20SE IOs from BANK 302

Board-to-board connector 2 interfaces (240-pin):
- 8x GTY high-speed transceivers (up to 32Gbps) from the PL block
- From PS block:
  - 1x GEM1 RGMII
  - 1x USB 2.0
  - 1x SD1
  - 1x Debug UART
  - 1x PMC I²C
  - Debug UART
  - 1x SPI1(3CS)
  - 1x CAN FD
  - JTAG
10/100/1000 Ethernet PHY
USB 2.0 transceiver PHY
FAN header