Laird Technologies Precision Metals – NIC 3.0 EMI Gaskets

Laird Technologies Precision Metals – NIC 3.0 Electromagnetic Interference (EMI) Gaskets are precision components that meet Open Compute Project (OCP) – NIC 3.0 specifications. The NIC 3.0 specification defines a third-generation mechanical form factor that allows for interoperability between compliant baseboards and OCP NIC 3.0 cards. Laird Technologies Precision Metals – NIC 3.0 Modules address some of the limitations of NIC 2.0, such as board space, mechanical profile, connector placement, and specification quality.

Features

  • Precision components for OCP – NIC 3.0. NIC 3.0
  • Small form factor (SFF) and large form factor (LFF) versions
  • Modules include fingerstock and side-spring parts

NIC 3.0 Module Layout with Chassis

Chart - Laird Technologies Precision Metals – NIC 3.0 EMI Gaskets

NIC 3.0 Module with Springs

Chart - Laird Technologies Precision Metals – NIC 3.0 EMI Gaskets
发布日期: 2020-04-13 | 更新日期: 2025-06-19