Microchip Technology dsPIC33AK256MPS306 200MHz 32-Bit DSC

Microchip Technology dsPIC33AK256MPS306 200MHz 32-Bit Digital Signal Controller (DSC) comes with a 32-/64-bit Floating-Point Unit (FPU) and up to 256KB Flash program memory and 64KB SRAM data memory in a small-footprint package (36/48/64 pins, VQFN/TQFP) for space-constrained designs. High-speed 40MSPS 12-bit ADCs, high-bandwidth 100MHz op amps with low input-voltage offset, fast 5nS comparators, and high-speed PWM outputs designed for next-generation server power supplies, industrial automation, advanced sensing, touch control, and motor control applications. The Microchip Technology dsPIC33AK256MPS306 features hardware crypto accelerators and support for post-quantum cryptography (PQC). Designed in accordance with ISO 26262 and IEC 61508 Functional Safety Compliance, the family offers support for AEC-Q100 qualification.

Features

  • Operating conditions
    • 3.0V to 3.6V: -40°C to +85°C, DC to 200MHz
    • 3.0V to 3.6V: -40°C to +125°C, DC to 200MHz planned
    • 3.0V to 3.6V: -40°C to +150°C, DC to 200MHz planned
  • High-performance DSP CPU
    • 32-bit rich instruction set for optimized speed and program code size
      • 16-bit dsPIC33 core compatible
      • Non-paged linear data/Flash 24-bit addressing space
      • 16-bit/32-bit instructions for optimized code size and performance
    • 32-bit wide data paths
    • Single and double precision Floating-Point Unit (FPU) coprocessor
    • 2kbyte instruction cache
    • Sixteen 32-bit working registers
    • Dual 72-bit accumulators supporting 32-bit and 16-bit fixed-point DSP operations
    • Eight-level deep working register sets
    • Eight-level deep accumulator register sets
    • Eight-level deep floating-point register sets
  • Memory
    • Up to 256Kbytes of program Flash memory
      • 10,000 erase/write cycle endurance
      • 20 years minimum data retention
      • Self-programmable under software control
      • Programmable code protection
      • Flash Error Correcting Code (ECC)
      • Dual Flash panel
      • Live update support
      • Programmable OTP regions
      • Entire Flash OTP by ICSP™ write inhibit
      • Separate 64x128-bit OTP
    • Up to 64Kbytes of static RAM
      • RAM Error Correcting Code (ECC)
      • RAM Memory Built-In Self-Test (MBIST)
  • Security
    • Flash OTP by ICSP write inhibit
      • On-chip secure boot Flash configurable as an immutable Root of Trust, with parts of the Flash memory that can be configured as OTP
    • Capabilities include
      • Secure boot support with validation of the host code image and the host code signature
      • Secure update support for host code: Secure encryption key storage and image decryption
      • X.509 certification storage, parsing, validation, and revocation, supporting both ECC and RSA
    • 128-bit Unique Device Serial Number for Identification (UUID)
    • Support for secure use cases
      • Secure boot
      • Key storage in the IRT/immutable secure boot region for realizing
        • Secure boot
        • Secure firmware update
        • Secure debug
    • Flash protection
      • Configuration of up to eight Flash protection regions across ranges of Flash addresses
      • Regions can be configured as
        • Immutable Root of Trust (IRT)
        • OTP region
        • A combination of R/W/X protections
      • Regions can be
        • Made permanent
        • Locked until device reset
        • Enabled/disabled during code execution
      • Flash protection regions can apply to the active partition, the inactive partition, or both
    • Crypto accelerator module (CAM)
      • AES-128, AES-192, and AES-256 (fully compliant with NIST FIPS 197)
        • ECB, CBC, CFB, OFB, CTR, GCM, CCM, XTS, CMAC modes
    • HASH/MAC
      • SHA3-224, SHA3-256, SHA3-384, SHA3-512, SHAKE128 and SHAKE256 capability
      • SHA-1, SHA-256, SHA-224, SHA-384 and SHA-512 capability
    • Public key cryptography with RSA, DSA, and ECC
      • RSA with/without Chinese Remainder Theorem (CRT) and up to 4096-bit key length
        • Prime Field P-192, P-224, P-256, P-384, P-521
        • Binary Field K-163, K-233, K-283, K-409, K-571
        • Binary Field B-163, B-233, B-283, B-409, B-571
        • P-224, P-256, P-384, and P-521 elliptic curve – ECDSA sign/verify
      • DSA support for up to 2048-bit key length
      • ECDH support for P256 and P224 curves
      • SECP256K1 (bitcoin/blockchain curve) ECDSA support
      • 256-bit Brainpool elliptic curve support – ECDSA, ECDH
      • Elliptic curve Diffie-Hellman (ECDH/ECDHE) key agreement
    • NIST-800-22 and NIST-800-90B compliant True Random Number Generator (TRNG)
  • High-resolution PWM
    • Multiple PWM generators with four pairs (eight outputs) generators, with Fine Edge Placement (FEP) resolution down to 78ps
    • Dead time for rising and falling edges
    • Dead-time compensation supports lower speed operation
    • Clock chopping for high-frequency operation
    • PWM support for
      • BLDC, PMSM, ACIM, SRM, and stepper motors
      • Constant on-time, hysteretic, burst-mode power applications
    • Fault and current limit inputs
    • Flexible trigger configuration for ADC triggering
  • High-speed analog-to-digital Converters
    • Three 12-bit resolution SAR ADCs
    • Up to 40Msps conversion rate per ADC
    • Up to 14 analog input pins
    • 16-bit sampling capability
    • Sixteen settings channels, where each channel can
      • Be assigned to any analog input (I/O pin or internal signal)
      • Be set to a different sampling time
      • Be configured as single-ended or differential
      • The conversion result can be formatted as unsigned or signed
      • The conversion result can be left-aligned (fraction format)
      • Has a separate 32-bit conversion result register
    • Supports four sampling modes
      • Oversampling of multiple samples
      • Integration of multiple samples
      • Window (multiple samples accumulated when the gate signal is active)
      • Single conversion
      • All channels have a digital comparator to detect configurable thresholds
      • The last three setting channels have the second result accumulator to implement second-order filters
  • Peripherals
    • Three 4-wire SPI modules (up to 50Mbps)
      • 32-byte FIFO
      • Variable data width
      • I2S mode
      • Multi-channel digital audio interfaces (I2S)
      • Three 16-bit resolution capable audio-rate ADCs at 156kSPS
      • DMA-enabled real-time audio streaming (eight DMA channels available)
      • TDM4/8/16/32 capable using framed SPI mode with DMA peripheral
      • Audio DSP for voice and acoustic processing
    • Two I2C modules w/address masking and IPMI support
    • One I3C module w/primary and secondary controller modes, and I3C/I2C target capability
    • Four protocol UARTs with 8-character RX/TX FIFOs and automated handling support for
      • LIN 2.2
      • DMX
      • Smart card (ISO 7816)
      • IrDA®
    • Two SENT modules
    • Three dedicated 32-bit timer/counter modules
    • Output capture/compare/PWM/timer modules
      • One MCCP
      • Four SCCPs
      • Flexible configuration as PWM, input capture, output compare, or timers
      • Two 16-bit timers or one 32-bit timer in each module
    • 8-channel hardware Direct Memory Access (DMA) module
    • One Quadrature Encoder Interface (QEI) module with four inputs (Phase A, Phase B, Home, and Index)
    • Serial encoder interface BiSS with up to four client encoders support
    • Four Configurable Logic Cells (CLC) with internal connections to select peripherals and PPS
    • Peripheral Trigger Generator (PTG)
      • 16 possible trigger sources to other peripheral modules
      • CPU-independent state machine-based instruction sequencer
    • One CAN FD module
    • Integrated Touch Controller (ITC) module
      • Advanced capacitive sensing, touch buttons, sliders, and wheels
      • Up to 24 self-capacitance and up to 72 mutual-capacitance channels
    • One Resolver-to-Digital Converter (RDC) module
  • Controller
    • High-current I/O sink/source
    • Programmable weak pull-up and pull-down resistors
    • Programmable open-drain outputs
    • Edge or level change notification interrupt on I/O pins
    • Peripheral Pin Select (PPS) remappable pins to reduce board layout complexity
    • Multiple interrupt vectors with individual programmable priority
    • Five external interrupt pins
    • Selectable oscillator options, including
      • 8MHz, 1% at 0ºC to 85ºC internal Fast RC (FRC) oscillator
      • 8MHz, 2% internal Backup Fast RC (BFRC) oscillator with 32kHz divided output
      • High-speed crystal resonator oscillator or external clock
      • Two 1.6GHz PLLs, which can be clocked from the FRC or a crystal oscillator
      • Reference clock output (REFO)
    • Low-power management modes (sleep and idle)
    • Power-on reset and brown-out reset
    • On-board 1.1V Buck voltage regulator for core voltage supply
  • Analog
    • Up to five 5nS analog comparators with 12-bit PDM DACs
      • Input multiplexing
      • Slope compensation
      • Up to two DAC output buffers
    • Three rail-to-rail 100MHz operational amplifiers with
      • 40V/μS slew rate
      • 1mV offset (typ.) with calibration feature
    • VREF/2 output available for op amp input biasing
    • Four 10µA constant-current sources, four programmable current sources
    • Integrated touch controller
      • Independent of ADC processing capability
      • Self and mutual CVD touch modes support
      • 11 to 24 touch ADC RX inputs
      • 9 to 15 touch TX outputs
  • Safety
    • Windowed Watchdog Timer (WDT)
    • Deadman Timer (DMT)
    • Eight I/O Integrity Monitors (IOIM)
    • Fail-Safe Clock Monitor (FSCM) with automatic switchover to backup clock source, featuring programmable over-frequency/under-frequency thresholds
    • Flash Error Correcting Code (ECC)
    • RAM Error Correcting Code (ECC)
    • RAM Memory Built-In Self-Test (MBIST)
    • 32-Bit Cyclic Redundancy Check (CRC) module
    • Entire Flash OTP by ICSP write inhibit
    • Internal voltage regulators
    • Virtual PPS pins for redundancy and monitoring
    • Temperature sensor diode
    • Power monitor for core voltage with configurable fault injection
  • Functional safety
    • Targets
      • ISO 26262 ASIL B
      • IEC 61508 SIL 2
      • IEC 60730 Class B
    • ISO 26262 and IEC 61508 compliant device development

Applications

  • Power Factor Correction (PFC)
    • Interleaved PFC, totem-pole PFC
    • Critical conduction PFC
    • Multi-level flying capacitor PFC
  • DC-DC converters
    • Buck, Boost, Forward, Flyback, Push-Pull
    • Half-/full-bridge
    • Phase-shift full-bridge
    • Resonant converters
  • DC-AC
    • Half-/full-bridge inverter
    • Resonant inverter
  • Motor control
    • BLDC
    • PMSM
    • SR
    • ACIM
  • Advanced sensor interfacing
  • High-performance embedded control
  • High-speed data acquisition and processing
  • Safety-critical designs
  • Digital lighting

Block Diagram

Block Diagram - Microchip Technology dsPIC33AK256MPS306 200MHz 32-Bit DSC
发布日期: 2026-07-07 | 更新日期: 2026-07-07