Molex 1.27mm间距、细小网格板对板连接器
Molex 1.27mm间距、细小网格板对板连接器是大电流密度板对板互连解决方案，采用1.27mm x 1.27mm网格样式。 细小网格可提供设计灵活性以及大电流密度（每英寸），适用于各种数据、汽车、工业和消费类应用。 Molex连接器系列设有单面极化插槽，可防止插入方向错误以及误插接。 该单面极化特性还可改善较小电路尺寸（六个或更小）的插配情况。 锁定窗（排针）和锁定斜面（插座）可确保连接器在插接时牢固保持。 定位钉可确保连接器在印刷电路板 (PCB) 上精确定位。
特性
- Based on a 1.27mm x 1.27mm grid pattern
- Single-sided polarization slot
- Prevents wrong orientation and mismating
- Improves mating for smaller circuit sizes of six and below
- Locking window and locking ramp ensure robust connector retention when mated
- Locating pegs (shrouded right-angle header, through-hole) ensure precise connector positioning on PCB
- Halogen free and RoHS compliant
应用
- Consumer/smart home
- Energy-efficient appliances
- Home theaters
- White goods
- Drones
- Automotive
- Car audio
- Navigation systems
- Telecommunications/networking
- Hubs
- Servers
- Routers
- Switches
- Mobile
- Smartphones
- Portable electronic devices
规范
- 1.27mm pitch
- 4 to 80 circuits
- 125VAC maximum voltage
- 4.3A maximum current (per circuit)
- 30mΩ contact resistance
- 1000MΩ insulation resistance
- Terminal retention force
- 2.22N in housing
- 4N for header
- 50 cycles minimum durability
- Force ranges
- 10N (4-circuit) to 15N (24-circuit) mating
- 0.5N (4-circuit) to 3N (24-circuit) unmating
- UL 94V-0, black LCP housing
- Copper alloy contacts
- Plating
- 0.05µ, 0.38µ, and 0.76µ gold (Au) in the contact area
- 2.00µ matte tin (Sn) in the solder tail area
- 1.27µ nickel (Ni) underplating
- -55°C to +105°C operating temperature range
视频
发布日期: 2017-04-17
| 更新日期: 2024-07-29