Parker Chomerics THERM-A-GAP® PAD 70TP 7W/m-K Thermal Putty Sheets
Parker Chomerics THERM-A-GAP® PAD 70TP Thermal Putty Sheets offer a typical thermal conductivity of 7.0W/m-K for superior thermal performance and long-term stability compared to conventional thermal pads. These high-performance, thermally conductive gap filler pads feature ultra-low compression force and are highly conformable. The putty sheets deliver effective heat transfer between electronic components and their associated cooling features, such as heat sinks. Unlike other gap pads, the PAD 70TP material is designed for static, one-time assembly, as it permanently conforms to displace air gaps caused by uneven surfaces or rough textures. Parker Chomerics THERM-A-GAP PAD 70TP 7W/m-K Thermal Putty Sheets feature an aluminum foil carrier with an acrylic pressure-sensitive adhesive (PSA) on one side.
Features
- Highly conformable, soft
- Low deflection force
- Electrically isolating
- One-time assembly
- Aluminum foil carrier with PSA
Applications
- Telecom equipment
- PC board to chassis
- Thermally enhanced BGAs
- Memory packages and modules
- GPUs and CPUs
- Industrial devices
Specifications
- 0.030" to 0.200" (0.76mm to 5.08mm) standard thickness
- 3.3 specific gravity
- 15 Shore 00 hardness
- -67°C to +392°C operating temperature range
- 7.0W/m-K thermal conductivity
- 0.27°C-in2/W (1.7°C-cm2/W) thermal impedance at 10psi, at 0.04" (1mm) thick, "G" version only
- 0.72J/g-K heat capacity
- 200kVac/7.9mm dielectric strength
- 1013Ω-cm volume resistivity
- 5.6 dielectric constant at 1000kHz
- 0.001 dissipation factor at 1000kHz
- 0.10% TML (0.03% CVCM) outgassing
Resources
Related Gap Pads
Parker Chomerics THERM-A-GAP™ Thermally Conductive Pads
Designed for applications where heat must be conducted over large and variable gaps.