Parker Chomerics THERM-A-GAP™ HCS10 1.0W/m-K Low Hardness Gap Pads
Parker Chomerics THERM-A-GAP™ HCS10 Gap Pads feature a low hardness of 4 Shore 00 and a thermal conductivity of 1.0W/m-K, offering a cost-effective solution for a variety of applications. These thermally conductive gap-filler pads offer excellent thermal performance and high conformability at low clamping forces. The HCS10 series is available in various thicknesses and is finished in standard sheet sizes of 9" x 9" and 18" x 18". Options include an "A" version with an aluminum foil carrier and a "G" version with a woven glass carrier. The "A" version includes a high-strength acrylic pressure-sensitive adhesive (PSA) for easy attachment to cold surfaces. Parker Chomerics THERM-A-GAP HCS10 Gap Pads provide a flexible solution for applications such as lighting, telecommunications, consumer electronics, memory modules, and automotive electronic control units (ECUs).
Features
- Ultra-low deflection force
- High thermal conductivity
- High tack surface reduces contact resistance
- Various thicknesses available
- Finished in standard sheet sizes of 9" x 9" and 18" x 18"
- Silicone binder
- Options
- "A" version: aluminum foil carrier, with acrylic PSA
- "G" version: woven glass carrier, no PSA
- UL 94V-0 flammability rated
- RoHS compliant
Applications
- Telecommunications equipment
- Consumer electronics
- Automotive ECUs
- LEDs and lighting
- Power conversion
- Power semiconductors
- Desktop computers, laptops, and servers
- Handheld devices
- Memory modules
- Vibration dampening
Specifications
- 0.010" to 0.200" (0.25mm to 5mm) standard thickness
- 2.0 specific gravity
- 4 Shore 00 hardness
- -67°C to +392°C operating temperature range
- 1.0W/m·K thermal conductivity
- 1.5°C-in2/W (9.7°C-cm2/W) thermal impedance at 10psi, at 0.04" (1mm) thick, "G" version only
- 1.0J/g-K heat capacity
- 200kVac/8mm dielectric strength
- 1014Ω-cm volume resistivity
- 5.3 dielectric constant at 1000kHz
- 0.013 dissipation factor at 1000kHz
- 0.44% TML (0.13% CVCM) outgassing
Application Examples
