Quectel FGD966X Wi-Fi 6, BLE 5.4, & 802.15.4 Module

Quectel FGD966X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 Module is a high-performance module in an LGA package with an ultra-compact 12mm x 12mm x 2mm size. This module supports MCS 0–MCS 9 rates over a 20MHz bandwidth with 256QAM and 2.4GHz/5GHz Wi-Fi bands. The FGD966X module is designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the module to be easily embedded in size-constrained applications, providing reliable connectivity. The module includes an integrated shielding cover and a laser-engraved label with improved heat dissipation and indelible markings.

Features

Wi-Fi/BLUETOOTH^® module supporting 2.4GHz/5GHz Wi-Fi bands, BLE 5.4, and 802.15.4 standard
SDIO 3.0/USB 2.0 interface that supports a higher data transmission rate and enables lower power consumption
Faster time-to-market with a simple design minimizes design-in time and development efforts

-40°C to 85°C wide operating temperature range
12mm x 12mm x 2mm dimensions

Specifications

IEEE 802.11 a/b/g/n/ac/ax WLAN protocol
1 x 1 Wi-Fi antenna
DSSS/ OFDM/ DBPSK/ DQPSK/ CCK/ BPSK/ QPSK/ 16QAM/ 64QAM/ 256QAM Wi-Fi modulation mode
WPA2/ WPA3 encryption mode
VBAT_3V3: 3.14V to 3.46V, typical 3.3V power supply voltage range