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Samtec NovaRay® Micro Rugged Backplane Connectors - Coming Soon

Samtec NovaRay® Micro Rugged Backplane Connectors offer an ultra-high-density design that allows for up to 128 differential pairs in a single connector. The NovaRay wafer design eliminates intrapair skew and large continuous ground blades between and surrounding the differential pairs, removing resonances when performing up to 128Gbps PAM4. Features include a surface mount design for better density and performance, an offset footprint for optimum signal integrity, and a Flyover® cable assembly in the design. Samtec NovaRay Micro Rugged Backplane Connectors support blind mate applications due to the optional guidance and keying, as well as standard weld tabs for secure connection to the board.

Features

  • Support blind mate applications
  • Optional guidance and keying
  • Standard weld tabs for a secure connection
  • Ultra-high-density design
  • Innovative wafer design
  • Open-pin-field capabilities

Applications

  • Servers and storage
  • High-performance computing (HPC)
  • AI
  • FPGA emulation
  • Datacom
  • Medical
  • Military/aerospace

Specifications

  • 128Gbps PAM 4 per channel
  • PCIe® 7.0 capable
  • 111 differential pairs/in2
  • 2.50mm contact wipe
  • 4 differential pairs per row
  • 4, 12, 16, or 32 rows
发布日期: 2025-09-19 | 更新日期: 2025-09-23