TE Connectivity IMPACT™高密度背板连接器
TE Connectivity提供IMPACT™连接器系统，以满足将来系统升级和下一代数据网络和通信设备的高速和高密度要求。IMPACT高密度背板连接器具有独特的宽边缘耦合设计，该设计在优化双差分线阵列中采用低阻抗、局部地面返回路径。双差分线以每线性英寸80对双线进行紧密耦合，并由接地层所包围，以隔离双线。这种创新设计可使高密度背板连接器实现高达25Gb/s的数据传输速率、减少串扰并获得最小的性能差异而提高整体带宽性能。TE IMPACT高密度背板连接器非常适合高速背板应用，如交换机、服务器/刀片服务器、存储器、路由器。
特性
- Differential pair density up to 80 pairs per linear inch
- Broad-edge-coupled, differential-pair system
- PCB routing complexity and costs are reduced by using 1.90mm x 1.35mm grid on backplane and daughter card
- Flexibility and advanced mechanical and electrical performance with two compliant-pin attach options
- In-line staggered, bifurcated contact beams in daughter card interfaces provides improved mating performance
规范
- 0.75A maximum current rating per pin
- 30VAC/DC maximum operating voltage
- 200 cycles durability
- -55°C to +85°C operating temperature range
Additional Resources
视频
发布日期: 2011-03-03
| 更新日期: 2025-03-19