Panasonic Electronic Components PAN1326系列蓝牙模块

Panasonic Electronic Components PAN1326主机控制接口(HCI) 蓝牙低功耗双模模块是Texas Instrument第7代蓝牙内核集成电路CC2564，具有易于使用的模块格式。PAN1326系列HCI蓝牙模块的特点是采用Panasonic仅85.5mm²的小型封装技术，设计用于适应1.3mm的PCB焊盘间距且仅为两层，以便于实施和制造。PAN1326模块设计与前代PAN1325 100%兼容。PAN1326系列模块独特的设计特点是有利于通过数据链在经典蓝牙和低功耗蓝牙之间进行无缝切换。PAN1326系列模块的电源电压范围为1.7-4.8V，工作温度范围为-20ºC - +70ºC，具备用于ACL和eSCO的极快算法及更多特性。PAN1326系列模块连接手机等移动设备以及健身传感器、手表和卫生保健附件等小型纽扣电池供电设备。

The PAN1326 module has been designed to be 100% compatible with the previous generation, the PAN1325. The unique design feature of the PAN1326 Series module is conducive to seamless switching between Bluetooth classic and Bluetooth low energy via a data chain. PAN1326 series modules have a supply voltage range of 1.7-4.8V, operating temperature range of -20°C to +70°C, very fast algorithm for both ACL and eSCO, and more. The PAN1326 series module connects mobile devices such as cellular phones and small button cell battery powered devices like fitness sensors, watches, and healthcare accessories.

特性

Communicates with BT Low Energy single mode devices
Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
Fully qualified Bluetooth v4.0 EDR, FCC and IC listed, CE complied
9.0 x 9.5 x 1.8mm (W x L x H) Dimensions
Low power scan method and inquiry scans at 1/3 normal power
Supports Extended Range Tx power with 10.5dBm typical output

SPP, HDP, Audio and others can run on the host processor (Integrates with TI's ultra low-power MSP430 microprocessor)
Interfaces
- 3.25Mbaud UART with transport layer detection
- PCM/I²S interface for digital audio