Panasonic Electronic Components PAN1326系列蓝牙模块
Panasonic Electronic Components PAN1326主机控制接口(HCI) 蓝牙低功耗双模模块是Texas Instrument第7代蓝牙内核集成电路CC2564,具有易于使用的模块格式。PAN1326系列HCI蓝牙模块的特点是采用Panasonic仅85.5mm²的小型封装技术,设计用于适应1.3mm的PCB焊盘间距且仅为两层,以便于实施和制造。PAN1326模块设计与前代PAN1325 100%兼容。PAN1326系列模块独特的设计特点是有利于通过数据链在经典蓝牙和低功耗蓝牙之间进行无缝切换。PAN1326系列模块的电源电压范围为1.7-4.8V,工作温度范围为-20ºC - +70ºC,具备用于ACL和eSCO的极快算法及更多特性。PAN1326系列模块连接手机等移动设备以及健身传感器、手表和卫生保健附件等小型纽扣电池供电设备。Panasonic's New PAN1326B / PAN1316B Bluetooth modules now support ten simultaneous BLE connections, up from six.
特性
- Communicates with BT Low Energy single mode devices
- Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
- Fully qualified Bluetooth v4.0 EDR, FCC and IC listed, CE complied
- Dimensions: 9.0 x 9.5 x 1.8mm (W x L x H)
- Profiles: SPP, HDP, Audio and others can run on the host processor (Integrates with TI's ultra low-power MSP430 microprocessor)
- Supports Extended Range Tx power with 10.5dBm typical output
- Low power scan method and inquiry scans at 1/3 normal power
- Interfaces
- 3.25Mbaud UART with transport layer detection
- PCM/I2S interface for digital audio
PAN1326/1316 Series Bluetooth® High Temperature Modules
ENW-89823C3KF PAN1316, CC2564, Bluetooth & Bluetooth Low Energy, HCI module
ENW89823A3KF PAN1326B, CC2564B, Bluetooth & Bluetooth Low Energy, HCI module
