TDK Soft Termination C系列MLCC
TDK的新型软终端C系列多层片式电容器在制造和最终组装过程中可提高抗弯曲特性（电路板抗挠性）。标准终端电容器易因陶瓷材料脆性而在焊接过程中损坏，但TDK软终端电容器具有吸收外部应力而保护其陶瓷体的导电树脂端接层。这些软终端电容器在使用无铅焊料时还可防止出现脆性焊点。 TDK软终端C系列MLCC的其他特点和优点包括，具有较好的温度循环性能并符合ROHS指令、WEE和REACH标准。软终端电容器可用于大多数TDK MLCC产品系列，最大达C3225的外壳尺寸并包含二合一的电容阵列系列。
特性
- Improved bending resistance (board flex resistance)
- Improved temperature cycle performance
- Conductive resin absorbs external stress to protect solder joint parts and capacitor body
- Available in TDK Automotive Grade (CGA) series
- Available in higher capacitance (up to 10μF) and voltage ranges (16V to 1kV)
- RoHS, WEE, and REACH compliant
应用
- Electronic circuits mounted on alumina substrate
- SMT applications that require bending robustness
- Lead-free solder applications in which solder joint reliability is problematic
- Solar micro-inverters
- Switching power supplies
- LED lighting
- Smart meters
- Telecom base stations
视频
Dimensions
发布日期: 2011-07-26
| 更新日期: 2024-10-22