TE Connectivity MULTI-BEAM卡缘连接器
TE Connectivity MULTI-BEAM卡缘连接器可提供卓越的功率和信号性能，以满足服务器市场对性能、外形以及成本效益的要求。这些连接器还非常适合用于全球数据通信应用。与现有的SEC-II功率卡缘设计相比，TE MULTI-BEAM卡缘连接器可节省高达60%的信号空间，功率密度比传统产品提高30%。该TE卡缘连接器系列还提供用于电源触点的43A最大额定电流。这些连接器的可扩展和模块化特性为配置和PCB设计提供了极大的灵活性。
特性
- High density
- Up to 60% signal space savings
- 30% power density improvement over legacy products
- High Connectivity tolerance
- High gatherability for blind-mate applications, ±2.0mm (X), ±1.54mm (Y)
- More clearance between PCB pads for signal contact to prevent solder bridging and 1.3mm larger pads for easier alignment
- Supports 1.57mm and 2.36mm PCB thickness
- Modular design
- Common power and signal contact module
- Flexible configuration with different contact quantities and positions
- High scalability (AC and DC, low power and high power)
- High performance
- Excellent mechanical and electrical performance
- Easy mating/un-mating with proper retention force
- Low-level contact resistance
规范
- Current rating
- Up to 43A (power contact)
- Up to 2A (signal contact)
- Voltage rating
- 100V maximum (power)
- 60V maximum (signal)
- 200 mating cycles durability
- EIA-364-27 mechanical shock
- EIA-364-28 vibration
- -55°C to +105°C operating temperature range
- Low mating force
- 6N maximum per power contact
- 1.5N maximum per signal contact
应用
- Datacenter
- Telecommunications
- Industrial automation
- Power systems
Related Connectors
TE Connectivity MULTI-BEAM Lite电源连接器
薄型连接器，具有出色的功率密度和多种电流选项。
发布日期: 2017-07-12
| 更新日期: 2026-01-12