Texas Instruments EVM-LEADLESS1 DIP接头适配器板

Texas Instruments EVM-LEADLESS1 DIP接头适配器板可对TI的常见无引线封装进行快速测试和电路板试验。该适配器板的占位尺寸可将TI的DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT和YZP表面贴装封装转变成100mil DIP排针。