特性
- Ultra small footprint (0402 case size)
- 1.0mmx0.6mm
- Industry standard package footprint
- Low height profile - >0.35mm
- Ultra low resistance, 70% less than competitors
- Ultra low Qg & Qgd
- Land grid array (LGA) package maximizes silicon content
- Optimized ESD ratings
- Ideal for space-constrained applications such as cell phones and tablets
- Easy second sourcing
- Supports thin Z-height products
- Low power dissipation
- Low switching losses; Improved light load performance
- Supports Id currents > 2 amps, double the nearest competitor
- Robust manufacturing
应用
- Handheld and mobile
- Load switch
- General purpose switching
- Battery
发布日期: 2015-03-06
| 更新日期: 2022-03-11

