Texas Instruments 同步降压NexFET™智能功率级

Texas Instruments同步降压NexFET™智能功率级采用行业标准占位尺寸和高度优化的设计,适用于大功率、高密度同步降压转换器。该器件集成了驱动器IC和功率MOSFET以完成功率级转换功能。凭借这些特性,在小尺寸封装中实现了大电流、高效率和高速开关能力。该款降压NexFET™智能功率级集成了精确的电流感测和温度感测功能,可提高准确度并简化系统设计。通过优化PCB占位面积,简化了整体系统设计并缩短了设计时间。

These characteristics achieve high-current, high-efficiency, and high-speed switching capability in a small outline package. To improve accuracy and simplify system design, the TI Buck NexFET™ Smart Power Stage integrates accurate current and temperature sensing functionality. Completing the overall system design is facilitated, and design time is reduced by optimizing the PCB footprint.

特性

  • High-frequency operation (up to 1.25MHz)
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3V and 5V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead time for shoot-through protection
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant – lead-free terminal plating
  • Halogen free
发布日期: 2017-11-07 | 更新日期: 2022-07-11