特性
- Ceramic SMT package with silicone lens
- Up to 700mA forward current
- 690mW at 500mA, 945mW at 700mA radiant power (typ.)
- Materials
- InGaN die
- Silicone (water clear) resin
- Gold-plated (Au) lead / termination finish
- 3.45mm x 3.45mm x 2.1mm dimensions
- Grouping parameters
- Forward voltage
- Radiant power
- Peak wavelength
- Reflow soldering method
- MSL 3 according to J-STD-020
应用
- Industrial curing
- Photocatalytic purification
- Poster printing curing
- Counterfeit money detectors
- Blood detectors
- Nail curing
- Teeth curing
Infographic
发布日期: 2016-09-09
| 更新日期: 2022-03-11
