THERM-A-GAP® Conductive, Cure-In-Place Compound

Parker Chomerics THERM-A-GAP® Conductive, Cure-in-Place (CIP) Compounds are two-component compounds that conform to irregular shapes and are vibration-dampening. No pre-mixing or weighing of components is required when using CIP 35 and CIP 60 compounds. The CIP 35 series features dispensable cure-in-place gap filling, potting, sealing, and encapsulating with a 55 Shore A hardness. The CIP 60 compound offers excellent thermal performance with 6.0W/m-K typical thermal conductivity and 50 Shore 00 hardness at full cure. Parker Chomerics THERM-A-GAP Conductive CIP Compounds are ideal for automotive, energy storage, power electronics, and telecommunications infrastructure applications.

结果: 5
选择 图像 零件编号
 制造商
描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS ECAD模型 产品
类型
导热性
颜色
最小工作温度
最大工作温度
可燃性等级
系列
Parker Chomerics 导热接口产品 Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 45CC Kit
数据表
15库存量
最低： 1
倍数： 1

Gap Fillers / Gap Pads / Sheets Silicone Compound, 2 Part 2.5W/m-K Green - 55 C + 200 C UL 94 V-0 CIP35
Parker Chomerics 导热接口产品 Thermal Conductive Cure-In-Place Compound, 2-Part, 2.5W/m-K, 200CC Kit
数据表
更多信息可用

CIP35
Parker Chomerics 导热接口产品 Thermal Conductive Cure-In-Place Compound, 6W/m-K, 45cc Kit, THERM-A-GAP CIP 60
数据表
CIP 60
Parker Chomerics 导热接口产品 Thermal Conductive Cure-In-Place Compound, 6W/m-K, 200cc Kit, THERM-A-GAP CIP 60
数据表
CIP 60
Parker Chomerics 导热接口产品 Thermal Conductive Cure-In-Place Compound, 6W/m-K, 400cc Kit, THERM-A-GAP CIP 60
数据表
CIP 60