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描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS
Intel BX80715E2434SRMXC
Intel CPU - 中央处理器 Boxed Intel Xeon E-2434 Processor (12M Cache, 3.40 GHz) FC-LGA16A
Intel BX80715E2436SRMXB
Intel CPU - 中央处理器 Boxed Intel Xeon E-2436 Processor (18M Cache, 2.90 GHz) FC-LGA16A
ADLINK Technology CFast 128GB
ADLINK Technology 存储卡 CFast Card, 128GB, SATA Mode, innodisk 112 Layars 3D TLC, 440R/250W, 3.3V, TBW:341TB, MTBF>3MH, OP Temp:0-70
ADLINK Technology CFast 64GB
ADLINK Technology 存储卡 CFast Card, 64GB, SATA Mode, innodisk 112 Layars 3D TLC, 260R/130W, 3.3V, TBW:170TB, MTBF>3MH, OP Temp:0-70
ADLINK Technology MICRO SD 3TE4 128GB ET
ADLINK Technology 存储卡 microSD, SDXC, 128GB, UHS-I U3/V30/C10, 90R/80W, 2.7-3.6V, TBW:340.9 TB, 112 layers 3D TLC, 11x15x0.7mm, OP Temp:-25-85
ADLINK Technology MICRO SD 3TE4 128GB WT
ADLINK Technology 存储卡 microSD, SDXC, 128GB, UHS-I U3/V30/C10, 90R/80W, 2.7-3.6V, TBW:340.9 TB, 112 layers 3D TLC, 11x15x0.7mm, OP Temp:-40-85
ADLINK Technology Micro SDXC Card 128G
ADLINK Technology 存储卡 microSD, SDXC/SDHC, 128GB, UHS-I U1/V10/A1, 95R/40W, 2.7-3.6V, Endurance:320 TB, 3D TLC, 11x15x0.7mm, OP Temp:-25 85
ADLINK Technology Micro SDXC Card 64G
ADLINK Technology 存储卡 microSD, SDXC/SDHC, 64GB, UHS-I U3/V30/A1, 100R/70W, 2.7-3.6V, Endurance:5800 TB, 3D TLC, 11x15x0.7mm, OP Temp:-25 85
Terasic Technologies B0844
Terasic Technologies 存储卡 64GB MicroSDXC card + SD adapter + USB card reader
ATP Electronics eMMC
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ATP Electronics eMMC
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ATP Electronics eMMC Conmercial Temp. -25C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
ATP Electronics eMMC Industrial Temp. -40C to +85C 9x10 TLC eMMC Small Footprint (STD PE)
NexAIoT 单板计算机 Mini-iTX Tiger Lake-UP3 Intel 11th Generation Core i7/i5/i3

NexAIoT 单板计算机 PICMG 1.3 full-size SBC, Q670E, Intel LGA1700
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NexAIoT 单板计算机 PICMG 1.3 full-size SBC, R680E, Intel LGA1700
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NexAIoT 单板计算机 PICMG 1.3 full-size SBC, H610E, Intel LGA1700
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NexAIoT 单板计算机 ATX Industrial Motherboard with the 8/9th Generation Intel Core i7/i5/i3
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SECO 模块化计算机 - COM COMe-C08-BT6 w/Intel i7-9850HE Hexa core a.2.6GHz (4.6GHZ in Turbo Boost), 12MB Chace, 45W TDP + ChipsetQM370 (AMT), EDP 2line;VGA; DP++ (DDI1); DP++ (DDI2); HDMI (DDI3) - Comm. Temp
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SECO 模块化计算机 - COM COMe-C08-BT6 w/Intel Core i7-9850HL , Hexa Core a.1.9GHz, 9MB Cache, 25W TDP + Chipset QM370 + EDP 4l; VGA; DP++ (DDI1); DP++ (DDI2); DP++ (DDI3) - Comm.Temp
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SECO 模块化计算机 - COM COMe-C55 w/Intel Whiskey Lake U i7-8665UE Quad Core a. 1.8GHz, 8MB Cache, 15W TDP, 8 PCIE + 0 PEG + 2 SATA, EDP, DP su DDI2, TPMSLB 9670, 3wire FAN, Comm.Temp.
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SECO 模块化计算机 - COM COMe-C55-CT6 w/ Intel i7-8665UE, QC a. 1.7GHz (Turbo Boost 4.4GHz) with HT, 15W TDP (12.5W..25W cTDP), eMMC 32GB, 6 PCIe x1 + 2
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SECO 模块化计算机 - COM COM Express Type 6 - COMe-C55 w/ Intel Whiskey Lake U Celeron 4305UE Dual Core, 5 PCIE + 4 PEG + 2 SATA, LVDS, 4wire Fan, CommTemp
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Alliance Memory eMMC eMMC , 64GB, 5.1, 3V, TLC Gen5 NAND, Automotive Grade, 153ball FBGA Package (11.5 x 13mm) , B die
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Alliance Memory eMMC eMMC , 64GB, 5.1, 3V, TLC Gen5 NAND, Industrial Grade, 153ball FBGA Package (11.5 x 13mm) , B die
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