IC 与器件插座

结果: 2,427
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 位置数量 排数 类型 节距 端接类型 触点电镀 行距 最小工作温度 最大工作温度 系列 封装
Mill-Max IC 与器件插座 20P GLD PIN GLD CONT
616预期 2026/8/31
最低: 1
倍数: 1

DIP / SIP Sockets 20 Position 2 Row Open Frame 2.54 mm Solder Tail Gold 7.62 mm - 55 C + 125 C 0110 Tube
Mill-Max IC 与器件插座 40P GLD PIN GLD CONT
860预期 2026/8/31
最低: 1
倍数: 1

DIP / SIP Sockets 40 Position 2 Row Open Frame 2.54 mm Solder Tail Gold 15.24 mm - 55 C + 125 C 0110 Tube

Mill-Max IC 与器件插座 18 POS .6" R/ANGLE
504预期 2026/8/20
最低: 1
倍数: 1

DIP / SIP Sockets 18 Position 2 Row Closed Frame 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C 0299 Tube
3M Electronic Solutions Division IC 与器件插座 BURN-IN SOIC SOCKET 16 Leads
56在途量
最低: 1
倍数: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
Mill-Max IC 与器件插座 32 POS. TIN PLATED through-hole
4,697在途量
最低: 1
倍数: 1

PLCC Sockets 32 Position 4 Row Closed Frame 2.54 mm Solder Tail Tin - 55 C + 125 C 0940 Tube
Aries Electronics IC 与器件插座 8P SOIC/DIP SOCKET
432预期 2026/8/26
最低: 48
倍数: 48
Various Socket Types 8 Position 2 Row SOIC and SOJ-to-DIP Adapter 2.54 mm Solder Pin Tin 7.62 mm - 55 C + 105 C 350000
Mill-Max IC 与器件插座 40P TIN PIN GLD CONT
1,157预期 2026/8/17
最低: 1
倍数: 1
DIP / SIP Sockets 40 Position 2 Row Open Frame 2.54 mm Solder Tail Gold 15.24 mm - 55 C + 125 C 0110 Tube
Aries Electronics IC 与器件插座 .040 THRU HOLE F/M DIP STRIPS
39预期 2026/8/26
最低: 1
倍数: 1

DIP / SIP Sockets 4 Position 2 Row Female DIP Strip 2.54 mm Solder Gold 5.08 mm - 55 C + 105 C F40
Aries Electronics IC 与器件插座 8P DIP FORK HDR GLD
836在途量
最低: 1
倍数: 1

DIP / SIP Sockets 8 Position 2 Row DIP Header 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C 600
Aries Electronics IC 与器件插座 28P .600/.300 ADAPT
10预期 2026/8/31
最低: 1
倍数: 1

Various Socket Types 28 Position 2 Row DIP Adapter 2.54 mm Solder Pin Gold 7.62 mm, 15.24 mm - 55 C + 105 C 1107254
Aries Electronics IC 与器件插座
23预期 2026/9/14
最低: 1
倍数: 1

DIP / SIP Sockets 14 Position 2 Row Standard DIP Socket with Wire Wrap Bifurcated Contact 2.54 mm Wire Wrap Tin 7.62 mm - 55 C + 105 C
Aries Electronics IC 与器件插座 14P SOLDER TIN/GLD
1,218预期 2026/9/10
最低: 1
倍数: 1

DIP / SIP Sockets 14 Position 2 Row Open Frame 2.54 mm Solder Tail Gold 7.62 mm - 55 C + 125 C 518
Aries Electronics IC 与器件插座 14-PIN SCON VERTSOCK
100预期 2026/9/14
最低: 2
倍数: 2

DIP / SIP Sockets 14 Position 2 Row Bifurcated Contact 2.54 mm Solder Tail Gold 7.62 mm - 55 C + 125 C 810
Aries Electronics IC 与器件插座 18P SOLDER TIN/GLD
308预期 2026/8/24
最低: 22
倍数: 22

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Gold 7.62 mm - 55 C + 125 C 518
Aries Electronics IC 与器件插座 20 PIN SOCKET
12预期 2026/9/7
最低: 1
倍数: 1

DIP / SIP Sockets 2 Row 2.54 mm Solder Pin Gold 800
Aries Electronics IC 与器件插座
5预期 2026/8/27
最低: 1
倍数: 1

PGA Sockets 208 Position Handle On Left PGA, ZIF, Test and Burn-In Socket 2.54 mm Solder Tail Gold - 65 C + 125 C
Aries Electronics IC 与器件插座
5预期 2026/8/27
最低: 1
倍数: 1

PGA Sockets 210 Position Standard ZIF (Zero-Insertion-Force) PGA Test and Burn-in Socket 2.54 mm Solder Tail Gold - 65 C + 125 C
Aries Electronics IC 与器件插座 24P FORK DIP HDR
180预期 2026/8/26
最低: 2
倍数: 2

DIP / SIP Sockets 24 Position 2 Row DIP Header 2.54 mm Solder Pin Tin 15.24 mm - 55 C + 105 C 600
Aries Electronics IC 与器件插座 24 PIN W/HANDLE
13预期 2026/9/7
最低: 1
倍数: 1

Zero Insertion Force (ZIF) Sockets 24 Position 2 Row Closed Frame 2.54 mm Solder Tail Gold 15.24 mm - 55 C + 105 C X55X
Aries Electronics IC 与器件插座 28-PIN-ZIF SOCKET
13预期 2026/9/7
最低: 1
倍数: 1

Zero Insertion Force (ZIF) Sockets 28 Position 2 Row ZIF DIP 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C 516
Aries Electronics IC 与器件插座 28P SOLDER TIN/GLD
391预期 2026/8/24
最低: 17
倍数: 17

DIP / SIP Sockets 28 Position 2 Row Open Frame 2.54 mm Solder Tail Gold 15.24 mm - 55 C + 125 C 518
Aries Electronics IC 与器件插座
3预期 2026/9/16
最低: 1
倍数: 1

PGA Sockets 324 Position Standard ZIF (Zero-Insertion-Force) PGA Test and Burn-in Socket 2.54 mm Solder Tail Gold - 65 C + 125 C
Mill-Max IC 与器件插座 STANDRD SOLDER TAIL SIP SOCKET
619预期 2026/8/31
最低: 1
倍数: 1

Headers 5 Position 1 Row Receptacle 2.54 mm Solder Pin Gold - 55 C + 125 C Tube
Mill-Max IC 与器件插座 20P TIN PIN GLD CONT
80预期 2026/8/25
最低: 1
倍数: 1
DIP / SIP Sockets 20 Position 2 Row Open Frame 2.54 mm Wire Wrap Gold 7.62 mm - 55 C + 125 C 0123 Tube
Aries Electronics 08-3513-10H
Aries Electronics IC 与器件插座
88预期 2026/8/31
最低: 1
倍数: 1

DIP / SIP Sockets 8 Position 2 Row DIP 2.54 mm Solder Pin Gold 7.62 mm + 105 C