RISC-V 核心 嵌入式解决方案

嵌入式解决方案类型

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选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS
M5Stack 多协议模块 Compact ESP32-C5 wireless module offering dual-band Wi-Fi 6, Bluetooth 5, Zigbee, Thread, USB-C, battery support, and flexible embedded connectivity expansion.

M5Stack 多协议模块 Compact ESP32-C5 wireless module with DIP headers, dual-band Wi-Fi 6, Bluetooth 5, Zigbee, Thread, USB-C, battery support, and flexible peripheral expansion.

Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this

Seeed Studio 开发板和工具包 - 其他处理器 Sipeed Maixduino for RISC-V AI + IoT
Seeed Studio 开发板和工具包 - 其他处理器 Grove AI HAT for Edge Computing
Renesas Electronics 开发板和工具包 - 其他处理器 RZ/FIVE SECURE SMARC EVK

Quectel 多协议模块
Quectel 多协议模块 Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C