RISC-V 核心 多协议模块

结果: 23
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 产品 封装
Espressif Systems 多协议模块 ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 983库存量
2,600预期 2026/11/2
¥51.528
¥45.4938
¥42.1829
¥38.872
最低: 1
倍数: 1
2.4 GHz, 5 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Bluetooth WiFi Thread, Zigbee Multiprotocol Module
Espressif Systems 多协议模块 ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 1,651库存量
16,250在途量
¥47.3131
¥41.0303
¥38.2166
¥35.7306
最低: 1
倍数: 1
240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Multiprotocol Modules
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH2S, Chip revision v1.2 and above, 2 MB SPI flash, PCB antenna, -40 C +105 C Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above 1,067库存量
8,450在途量
¥31.0185
¥26.8827
¥25.0634
¥23.4136
最低: 1
倍数: 1
2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C PCB Antenna 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules
u-blox 多协议模块 ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 4MB flash 500库存量
剪切带
¥43.1773
¥41.8552
¥38.0471
卷轴
¥38.0471
最低: 1
倍数: 1
: 500
2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Multiradio Modules Reel, Cut Tape
u-blox 多协议模块 ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 4MB flash 304库存量
500预期 2027/7/12
剪切带
¥44.4203
¥43.0982
¥39.211
卷轴
¥39.211
最低: 1
倍数: 1
: 500
2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Multiradio Modules Reel, Cut Tape
u-blox 多协议模块 ESP32-C6, 802.11ax+BLE, PCB ant, open CPU, 8MB flash 406库存量
剪切带
¥48.7143
¥47.234
¥42.9287
卷轴
¥42.9287
最低: 1
倍数: 1
: 500
2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Multiradio Modules Reel, Cut Tape
Seeed Studio 多协议模块 XIAO ESP32S3 - 2.4GHz WiFi, BLE 5.0, Dual-Core, Battery Charge,Smart Homes, IoT, Wearable Devices, Robotics 443库存量
2,740在途量
¥61.9579
最低: 1
倍数: 1
2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n SoC Modules
u-blox 多协议模块 ESP32-C6, 802.11ax+BLE, ant pin, open CPU, 8MB flash 154库存量
500预期 2027/5/6
剪切带
¥44.4203
¥41.7761
卷轴
¥41.7761
最低: 1
倍数: 1
: 500
2.4 GHz to 2.484 GHz GPIO, I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 14.3 mm x 10.4 mm x 1.9 mm Multiradio Modules Reel, Cut Tape
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 3库存量
剪切带
¥124.074
¥109.9264
¥102.4006
¥94.7053
最低: 1
倍数: 1
ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Wireless Modules Reel
SparkFun 多协议模块 ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons 29库存量
¥31.0185
最低: 1
倍数: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee 802.11b/g/n/ax, Bluetooth 5.3, Bluetooth Mesh, Thread, Zigbee
SparkFun 多协议模块 ESP32-C6 is Espressif s first WiFi 6 SoC integrating 2.4 GHz WiFi 6 Bluetooth 5 (LE) and the 802.15.4 protocol. It features an industry-leading RF performance with reliable security features and multiple memory resources for IoT products. It cons 5库存量
¥25.8883
最低: 1
倍数: 1
2.4 GHz GPIO, I2C, I2S, Parallel, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.3, Bluetooth Mesh 802.11 b/g/n/ax Thread, Zigbee 802.11b/g/n/ax, Bluetooth 5.3, Bluetooth Mesh, Thread, Zigbee
Espressif Systems 多协议模块 ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
14,914在途量
¥53.9349
¥48.2284
¥39.6178
¥36.6459
最低: 1
倍数: 1
240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Multiprotocol Modules
Espressif Systems 多协议模块 ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
5,846在途量
¥42.5106
¥36.8945
¥34.3294
¥32.092
最低: 1
倍数: 1
240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm Multiprotocol Modules
Espressif Systems 多协议模块 SMD Module, ESP32-H2FH4S, Chip revision v1.2 and above, 4 MB SPI flash, PCB antenna, -40 C +105 C. Required ESP-IDF version: v5.1.6 and v5.2.5, v5.3.3 (expected on 3/27), v5.4.1 (expected on 4/4), and above
11,695在途量
¥31.5948
¥27.3799
¥25.5606
¥23.8204
最低: 1
倍数: 1
2.402 GHz to 2.48 GHz 20 dBm SPI 3 V 3.6 V - 40 C + 105 C PCB Antenna 16.6 mm x 13.2 mm x 2.4 mm Bluetooth, BLE 802.15.4 (ANT, Thread, Zigbee) Bluetooth Modules
Seeed Studio 多协议模块 Seeed Studio XIAO ESP32-C6(Tape & Reel)
62在途量
¥40.5331
最低: 1
倍数: 1
Development Boards
Seeed Studio 多协议模块 Seeed Studio XIAO ESP32C3
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2.4 GHz I2C, SPI, UART - 40 C + 85 C 21 mm x 17.5 mm 802.11 b/g/n SoC Modules
GigaDevice 多协议模块 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 15 x 12.4 / 21 GPIO / -40-105 degC
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2.402 GHz to 2.48 GHz 23.4 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C External 9.6 mm x 12.4 mm x 2.4 mm Bluetooth LE V5.2 IEEE 802.11 b/g/n/ax Wireless Module
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / external IPEX connection
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RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
GigaDevice 多协议模块 RISC-V with BLE 5.2 and WiFi 6 certified module / 24 x 16 / 18 GPIO / -40-105 degC / onboard PCB antenna
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RISC-V 2.412 GHz to 2.484 GHz 23.2 dBm UART 3 V 3.6 V - 40 C + 105 C 24 mm x 16 mm x 2.2 mm BLE WiFi Module
M5Stack 多协议模块 Compact ESP32-C5 wireless module offering dual-band Wi-Fi 6, Bluetooth 5, Zigbee, Thread, USB-C, battery support, and flexible embedded connectivity expansion.
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2.4 GHz, 5 GHz USB 17.6 mm x 19.1 mm x 3.4 mm BLE WiFi Modules
M5Stack 多协议模块 Compact ESP32-C5 wireless module with DIP headers, dual-band Wi-Fi 6, Bluetooth 5, Zigbee, Thread, USB-C, battery support, and flexible peripheral expansion.
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2.4 GHz, 5 GHz USB 17.6 mm x 19.1 mm x 3.4 mm BLE WiFi
Quectel 多协议模块
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2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax 802.11 b/g/n/ax, BLE 5.2
Quectel 多协议模块 Wi-Fi 6, 2.4GHz, BLE5.2, RISC-V, ACK SDK for Matter, 4MB Flash, 512 KB SRAM, PCB antenna, -40C to 105C
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2.4 GHz UART 3 V 3.6 V - 40 C + 105 C 17.3 mm x 15 mm x 2.8 mm BLE 5.2 802.11 b/g/n/ax 802.11 b/g/n/ax, BLE 5.2 Reel