嵌入式解决方案

模块化计算机 - COM JUMPtec HSP COMe-bDV7 (E2) through

单板计算机 HSP-Qseven-Q7ALi2

模块化计算机 - COM JUMPtec COMe RefCarrier-i T10 TNIP

开发板与工具包 - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1

开发板与工具包 - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0

模块化计算机 - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

模块化计算机 - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

模块化计算机 - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.

模块配件 Cable Kit for conga-PA5 containing cab-Pico-ITX-USB2.0-Twin, cab-Pico-ITX-Audio Cable Adapter, cab-Pico-ITX-Buttons-LED, cab-Pico-ITX-GPIO, cab-Pico-ITX-RS232, cab-Pico-ITX-RS485, cab-Pico-ITX-External-Power, cab-Pico-ITX-Feature and cab-Pico-ITX-SAT

模块化计算机 - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.

模块化计算机 - COM COM Express Type 7 Basic module based on Intel Atom C3308 2-core processor with 1.6 GHz, 4MB Cache and dual channel DDR4 2133 MT/s memory interface for up to 64 GByte (formerly Denverton). Features four 2.5GbE KX interface ports. Commercial tempera

模块化计算机 - COM COM HPC Size A module with Intel Core i3-1115GRE Processor, dual core with 3.0GHz (up to 3.9GHz), 6MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (28W TDP), no IPU, TCC, TSN, Inband ECC. Support for extended Temp.